One‐Dimensional Nano‐Interconnection Formation

Abstract Interconnection of one‐dimensional nanomaterials such as nanowires and carbon nanotubes with other parts or components is crucial for nanodevices to realize electrical contacts and mechanical fixings. Interconnection has been being gradually paid great attention since it is as significant as nanomaterials properties, and determines nanodevices performance in some cases. This paper provides an overview of recent progress on techniques that are commonly used for one‐dimensional interconnection formation. In this review, these techniques could be categorized into two different types: two‐step and one‐step methods according to their established process. The two‐step method is constituted by assembly and pinning processes, while the one‐step method is a direct formation process of nano‐interconnections. In both methods, the electrodeposition approach is illustrated in detail, and its potential mechanism is emphasized.