High-Density 3D-Boron Nitride and 3D-Graphene for High-Performance Nano–Thermal Interface Material
Source abstract
Abstract
Compression studies on three-dimensional foam-like graphene and h-BN (3D-C and 3D-BN) revealed their high cross-plane thermal conductivity (62–86 W m –1 K –1 ) and excellent surface conformity, characteristics essential for thermal management needs. Comparative studies to state-of-the-art materials and other materials currently under research for heat dissipation revealed 3D-foam’s improved performance (20–30% improved cooling, temperature decrease by Δ T of 44–24 °C).
Source: openalex_inverted_index · Quality: baseline
Research context
OpenAlex topics: Thermal properties of materials · Graphene research and applications · Thermal Radiation and Cooling Technologies
SciVX discovery tags are terminology-based. OpenAlex topics are source-provided classifications.
Affiliations
CNRS-International NTU Thales Research Alliance (CINTRA) UMI 3288, Research Techno Plaza, 50 Nanyang Drive, Singapore 637553, Singapore
Institute of Microelectronics, Agency for Science, Technology and Research (A*Star), 11 Science Park Road, Singapore 117685, Singapore
Temasek Laboratories@NTU, 50 Nanyang Avenue, Singapore 639798, Singapore
Funding
Ministry of Education - Singapore
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