Recent Advances and Future Prospects for Memristive Materials, Devices, and Systems
Abstract
Research context
OpenAlex topics: Advanced Memory and Neural Computing · Neural dynamics and brain function · Ferroelectric and Negative Capacitance Devices
SciVX discovery tags are terminology-based. OpenAlex topics are source-provided classifications.
Affiliations
Department of Mechanical Engineering, Massachusetts Institute of Technology (MIT), Cambridge, Massachusetts 02139, United States
Research Laboratory of Electronics, Massachusetts Institute of Technology (MIT), Cambridge, Massachusetts 02139, United States
Department of Materials Science and Engineering, Massachusetts Institute of Technology (MIT), Cambridge, Massachusetts 02139, United States
Department of Materials Science and Engineering, Pohang University of Science and Technology (POSTECH), Pohang 37673, Republic of Korea
Chair of Fundamentals of Electrical Engineering, Institute of Principles of Electrical and Electronic Engineering, Faculty of Electrical and Computer Engineering, School of Engineering Sciences, Technische Universität Dresden, Dresden 01069, Germany
Department of Materials, University of Oxford, Oxford OX1 3PH, United Kingdom
Department of Electrical Engineering, Stanford University, Stanford, California 94305, United States
The School of Electrical Engineering, Korea Advanced Institute of Science and Technology (KAIST), Daejeon 34141, Republic of Korea
Sandia National Laboratories, Albuquerque, New Mexico 87123, United States
IBM Research Europe, 8803 Rüschlikon, Switzerland
School of Electrical, Computer and Energy Engineering, Arizona State University, Tempe, Arizona 85281, United States
Physical Science and Engineering Division, King Abdullah University of Science and Technology (KAUST), Thuwal 23955-6900, Saudi Arabia
School of Materials Science and Engineering, Gwangju Institute of Science and Technology (GIST), Gwangju 61005, Republic of Korea
Department of Electrical Engineering and Computer Science, Massachusetts Institute of Technology (MIT), Cambridge, Massachusetts 02139, United States
Department of Nuclear Science and Engineering, Massachusetts Institute of Technology (MIT), Cambridge, Massachusetts 02139, United States
Advanced Materials Metrology and Life Sciences Division, Istituto Nazionale di Ricerca Metrologica (INRiM), Strada delle Cacce, Torino 10135, Italy
Department of Applied Science and Technology, Politecnico di Torino, c.so Duca degli Abruzzi, Torino 10129, Italy
Advanced Thin Film Technology Division, Institute of Materials Science, Technische Universität Darmstadt, Darmstadt 64287, Germany
Department of Applied Physics, Hong Kong Polytechnic University, Hong Kong 999077, China
Department of Electrical and Electronic Engineering, The University of Hong Kong, Pokfulam Road, Hong Kong, China
Department of Materials Science and Engineering, Northwestern University, Evanston, Illinois 60208, United States
Department of Chemistry, Northwestern University, Evanston, Illinois 60208, United States
Department of Electrical and Computer Engineering, Northwestern University, Evanston, Illinois 60208, United States
Department of Electrical and Computer Engineering, University of California Santa Barbara, Santa Barbara, California 93106, United States
Research Centre Juelich, PGI-7, Wilhelm-Johnen-Str., Juelich 52425, Germany
Funding
Samsung Science and Technology Foundation · Semiconductor Research Corporation · Office of Science · National Natural Science Foundation of China · Electronic Components and Systems for European Leadership · Division of Materials Research · Research Grants Council, University Grants Committee · European Metrology Programme for Innovation and Research · HORIZON EUROPE European Innovation Council · National Research Foundation of Korea · Deutsche Forschungsgemeinschaft · H2020 Future and Emerging Technologies · H2020 LEIT Biotechnology · MIT-IBM Watson AI Lab