journal article·2009-09-22Open access

Etching of Graphene Devices with a Helium Ion Beam

Max C. Lemme, David C. Bell, James R. Williams, Lewis A. Stern, Britton W. H. Baugher, Pablo Jarillo-Herrero, Charles M. Marcus

ACS Nano· Volume 3· Issue 9

Abstract

We report on the etching of graphene devices with a helium ion beam, including in situ electrical measurement during lithography. The etching process can be used to nanostructure and electrically isolate different regions in a graphene device, as demonstrated by etching a channel in a suspended graphene device with etched gaps down to about 10 nm. Graphene devices on silicon dioxide (SiO(2)) substrates etch with lower He ion doses and are found to have a residual conductivity after etching, which we attribute to contamination by hydrocarbons.
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Research context

OpenAlex topics: Graphene research and applications · Nanopore and Nanochannel Transport Studies · Carbon Nanotubes in Composites

SciVX discovery tags are terminology-based. OpenAlex topics are source-provided classifications.

Affiliations

Department of Physics

School of Engineering and Applied Sciences, and

Center for Nanoscale Systems, Harvard University, Cambridge Massachusetts 02138

Carl Zeiss SMT, Inc., Peabody, Massachusetts 01960

Department of Physics, Massachusetts Institute of Technology, Cambridge, Massachusetts 02139

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