journal article·2011-06-28Open access

Thermal Conduction in Aligned Carbon Nanotube–Polymer Nanocomposites with High Packing Density

Amy M. Marconnet, Namiko Yamamoto, Matthew A. Panzer, Brian L. Wardle, Kenneth E. Goodson

ACS Nano· Volume 5· Issue 6

Abstract

Nanostructured composites containing aligned carbon nanotubes (CNTs) are very promising as interface materials for electronic systems and thermoelectric power generators. We report the first data for the thermal conductivity of densified, aligned multiwall CNT nanocomposite films for a range of CNT volume fractions. A 1 vol % CNT composite more than doubles the thermal conductivity of the base polymer. Denser arrays (17 vol % CNTs) enhance the thermal conductivity by as much as a factor of 18 and there is a nonlinear trend with CNT volume fraction. This article discusses the impact of CNT density on thermal conduction considering boundary resistances, increased defect concentrations, and the possibility of suppressed phonon modes in the CNTs.
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Research context

OpenAlex topics: Thermal properties of materials · Carbon Nanotubes in Composites · Thermal Radiation and Cooling Technologies

SciVX discovery tags are terminology-based. OpenAlex topics are source-provided classifications.

Affiliations

Department of Mechanical Engineering, Building 530, Room 224, 440 Escondido Mall, Stanford University, Stanford, California 94305, United States

Department of Aeronautics and Astronautics, Room 41-317, 77 Massachusetts Avenue, Massachusetts Institute of Technology, Cambridge, Massachusetts 02139, United States

References (41)

Show source-provided references
1. Kim P. · Phys. Rev. Lett. · 2001 · 87 · 21550210.1103/PhysRevLett.87.215502 ↗
2. Berber S. · Phys. Rev. Lett. · 2000 · 84 · 461310.1103/PhysRevLett.84.4613 ↗
3. Tong, T.; Majumdar, A.; Yang, Z.; Kashani, A.; Delzeit, L.; Meyyappan, M.Indium Assisted Multiwalled Carbon Nanotube Array Thermal Interface Materials. 10th Intersociety Conference on Thermal and Thermomechanical Phenomena in Electronics Systems,San Diego, CA, May 30–June 2, 2006; pp1406–1411.
4. Tong T. · IEEE Trans. Compon. Packag. Technol. · 2007 · 30 · 9210.1109/TCAPT.2007.892079 ↗
5. Gojny F. H. · Polymer · 2006 · 47 · 203610.1016/j.polymer.2006.01.029 ↗
6. Bryning M. B. · Appl. Phys. Lett. · 2005 · 87 · 16190910.1063/1.2103398 ↗
7. Mamunya Y. · Compos. Sci. Technol. · 2008 · 68 · 198110.1016/j.compscitech.2007.11.014 ↗
8. Hu, X.; Jiang, L.; Goodson, K. E.Thermal Conductance Enhancement of Particle-Filled Thermal Interface Materials Using Carbon Nanotube Inclusions. 9th Intersociety Conference on Thermal and Thermomechanical Phenomena in Electronics Systems,Las Vegas, NV, June 1–4, 2004; pp63–69.
9. Bonnet P. · Appl. Phys. Lett. · 2007 · 91 · 20191010.1063/1.2813625 ↗
10. Guthy C. · J. Heat Transfer · 2007 · 129 · 109610.1115/1.2737484 ↗
11. Nan C. W. · Chem. Phys. Lett. · 2003 · 375 · 66610.1016/S0009-2614(03)00956-4 ↗
12. Nan C.-W. · J. Appl. Phys. · 1997 · 81 · 669210.1063/1.365209 ↗
13. Kumar S. · Appl. Phys. Lett. · 2007 · 90 · 10410510.1063/1.2712428 ↗
14. Nan C.-W. · Appl. Phys. Lett. · 2004 · 85 · 354910.1063/1.1808874 ↗
15. Prasher R. S. · Phys. Rev. Lett. · 2009 · 102 · 10590110.1103/PhysRevLett.102.105901 ↗
16. Borca-Tasciuc, T.; Borca-Tasciuc, D. A.; Gang, C. APhotothermoelectric Technique for Anisotropic Thermal Diffusivity Characterization of Nanowire/Nanotube Composites. Annual IEEE Semiconductor Thermal Measurement Management Symposium,San Jose, CA, March 15–17, 2005; pp283–291.10.1109/STHERM.2005.1412193 ↗
17. Yu A. · Appl. Phys. Lett. · 2006 · 89 · 13310210.1063/1.2357580 ↗
18. Hu H. · J. Phys. Chem. B · 2005 · 109 · 1152010.1021/jp050781w ↗
19. Liu C. H. · Appl. Phys. Lett. · 2005 · 86 · 12310610.1063/1.1887839 ↗
20. Ivanov I. · Appl. Phys. Lett. · 2006 · 89 · 22311010.1063/1.2397008 ↗
21. Grunlan J. C. · Macromol. Mater. Eng. · 2006 · 291 · 103510.1002/mame.200600191 ↗
22. Borca-Tasciuc T. · J. Nanosci. Nanotechnol. · 2007 · 7 · 158110.1166/jnn.2007.657 ↗
23. Du F. · J. Polym. Sci., Part B: Polym. Phys. · 2006 · 44 · 151310.1002/polb.20801 ↗
24. Haggenmueller R. · Macromolecules · 2007 · 40 · 241710.1021/ma0615046 ↗
25. Huang H. · Adv. Mater. · 2005 · 17 · 165210.1002/adma.200500467 ↗
26. Wu Y. · Appl. Phys. Lett. · 2005 · 87 · 21310810.1063/1.2133916 ↗
27. Garcia E. J. · J. Nano Syst. Technol. · 2009 · 1 · 1
28. Cebeci H. · Compos. Sci. Technol. · 2009 · 69 · 264910.1016/j.compscitech.2009.08.006 ↗
29. Hart A. J. · J. Phys. Chem. B · 2006 · 110 · 825010.1021/jp055498b ↗
30. Wardle B. L. · Adv. Mater. · 2008 · 20 · 270710.1002/adma.200800295 ↗
31. Cola B. A. · Appl. Phys. Lett. · 2007 · 90 · 09351310.1063/1.2644018 ↗
32. Panzer M. A. · J. Heat Transfer · 2008 · 130 · 05240110.1115/1.2885159 ↗
33. Wang X. · J. Appl. Phys. · 2005 · 97 · 06430210.1063/1.1854725 ↗
34. Yamamoto, N.Multiscale Electrical and Thermal Properties of Aligned Multi-Walled Carbon Nanotubes and Their Composites. M.S.Thesis, Massachusetts Institute of Technology,Cambridge, MA, 2011, online at http://dspace.mit.edu/handle/1721.1/63032
35. Meshot E. R. · Appl. Phys. Lett. · 2008 · 92 · 11310710.1063/1.2889497 ↗
36. Panzer M. A. · Nano Lett. · 2010 · 10 · 239510.1021/nl100443x ↗
37. Huxtable S. T. · Nat. Mater. · 2003 · 2 · 73110.1038/nmat996 ↗
38. Clancy T. C. · Int. J. Therm. Sci. · 2010 · 49 · 155510.1016/j.ijthermalsci.2010.05.007 ↗
39. Hu X. J. · J. Heat Transfer · 2007 · 129 · 9110.1115/1.2401202 ↗
40. Duong, H.; Yamamoto, N.; Panzer, M.; Marconnet, A.; Goodson, K. E.; Papavassiliou, D.; Maruyama, S.; Wardle, B.Thermal Properties of Vertically Aligned Carbon Nanotube-Nanocomposites Boundary Resistance and Intercarbon Nanotube Contact: Experiments and Modeling. American Physical Society, Meeting 2009,Pittsburgh, PA, March 16–20, 2009; abstr. no. J26.002.10.1088/0957-4484/20/15/155702 ↗
41. Marconnet, A.; Yamamoto, N.; Panzer, M.; Duong, H.; Wardle, B.; Goodson, K. E.Thermal Conductivity and Boundary Resistance of Aligned Carbon Nanotube Films and Their Polymeric Composites. Material Research Society Symposium Proceedings,San Francisco, CA, April 13–17, 2009.