Microstructure and erosion characteristics of Ni-AlN thin films prepared by electrodeposition

Abstract Ni-AlN thin films were successfully fabricated via direct-current (DC), pulse-current (PC), and ultrasonic-assisted pulse-current (UAPC) deposition. The microstructure, microhardness, and erosion characteristics of the Ni-AlN thin films were determined with the use of scanning probe microscopy (SPM), X-ray diffraction (XRD), Vickers hardness test, electrochemical station, and scanning electron microscopy (SEM). SPM results revealed that the Ni-AlN thin films synthesized by UAPC deposition have a compact and fine morphology with average grain diameters of the Ni and AlN particles of approximately 97.7 and 40.2 nm, respectively. Based on the XRD results, the Ni-AlN thin films consist of Ni and AlN phases. The Ni-AlN thin films prepared by DC, PC, and UAPC deposition at 4.5 A/dm ² current density exhibited an optimum microhardness value of 904, 943, and 987 HV, respectively. Based on the erosion test results, the films prepared by UAPC deposition possesses the best corrosion resistance among the prepared thin films. The corrosion potentials of the DC-, PC-, and UAPC-deposited films were -0.552, -0.473, and -0.446 V vs. SCE, respectively.