Thermal expansion, electrical conductivity and hardness of Mn 3 Zn 0.5 Sn 0.5 N/Al composites
Source abstract
Abstract
Abstract Mn 3 Zn 0.5 Sn 0.5 N/Al composites were successfully prepared by sintering at 623 K and 723 K. It is found that the thermal expansion of Al is effectively decreased with the addition of negative thermal expansion material Mn 3 Zn 0.5 Sn 0.5 N, which plays the role of the thermal expansion compensator in the composite system. The thermal expansion of composites can be tailored by adjusting the volume fraction of Mn 3 Zn 0.5 Sn 0.5 N. In particular, 40 vol.%-Mn 3 Zn 0.5 Sn 0.5 N/Al composite sintered at 723 K has a low thermal expansion coefficient of 2.38×10 −6 K −1 . The thermal expansion of Mn 3 Zn 0.5 Sn 0.5 N/Al composites matches well with those calculated from the rule of mixture (ROM) estimation. The ROM model can be used to predict the thermal expansion of Mn 3 Zn 0.5 Sn 0.5 N/Al composite and design Mn 3 Zn 0.5 Sn 0.5 N/Al composite with a particular thermal expansion. Mn 3 Zn 0.5 Sn 0.5 N/Al composites exhibit excellent electrical conductivities at the level of 10 4 S/cm. The hardness of the as-prepared composites increases by adding Mn 3 Zn 0.5 Sn 0.5 N in Al.
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Research context
OpenAlex topics: Thermal Expansion and Ionic Conductivity · Ferroelectric and Piezoelectric Materials · Advanced Battery Materials and Technologies
SciVX discovery tags are terminology-based. OpenAlex topics are source-provided classifications.
Affiliations
School of Materials Science and Engineering , Jiangsu University , Zhenjiang 212013 , Jiangsu , P.R. China
Institute for Advanced Materials , Jiangsu University , Zhenjiang 212013 , Jiangsu, P.R. China
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