Formation of homogenous copper film on MWCNTs by an efficient electroless deposition process
Source abstract
Abstract
Abstract In this study, copper-coated multi-walled carbon nanotubes (MWCNTs) were prepared using electroless deposition process with an efficient bath composition. As-received MWCNTs underwent acid treatment and subsequent sensitization with tin and activation with palladium before the copper coating process. The electroless deposition process was performed in a bath, which contained copper sulphate pentahydrate as a copper precursor, potassium sodium tartrate as a complexing agent, and formaldehyde as a reducing agent. Surface modifications of MWCNTs were studied by Fourier transform infrared spectroscopy, imaging techniques (scanning electron microscopy, transmission electron microscopy), and X-ray diffraction. On the basis of the results, it was observed that the coating layer covers most surfaces of the nanotubes. Furthermore, copper oxide is also deposited on the surfaces of MWCNTs. The total amount of metals after each sensitization, activation, and metallization step was determined by thermo gravimetric method and induced coupled plasma atomic emission spectroscopy. Coating of MWCNTs was accomplished successfully through adjusting proper chemical ratios and concentrations. The calculated bath efficiency was about 99%.
Source: crossref · Quality: baseline
Research context
OpenAlex topics: Electrodeposition and Electroless Coatings · Carbon Nanotubes in Composites · Supercapacitor Materials and Fabrication
SciVX discovery tags are terminology-based. OpenAlex topics are source-provided classifications.
Affiliations
School of Mechanical Engineering, College of Engineering, University of Tehran, P.O. Box 11155-4563, Tehran, Iran
Nano Research Laboratory, Allameh Mohaddes Nouri University, Nour, P.O. Box 46415-451, Iran
Department of Mechanical Engineering, Babol University of Technology, P.O. Box 484, Iran
University of Strasbourg, ICube/CNRS, 2 Rue Boussingault, 67000 Strasbourg, France
References (45)
Show source-provided references
1. Ajayan P, Zhou O. Carbon Nanotubes 2001, 391–425.
2. Deng F, Zheng QS, Wang QS, Nan CW. Appl. Phys. Lett. 2007, 90, 021914-021914-021913.
3. Liang X, Wang S, Duan X, Zhang Z, Chen Z, Zhang J, Peng L. J. Nanosci. Nanotechnol. 2007, 7, 4–5.10.1166/jnn.2007.340 ↗
4. Baniassadi M, Laachachi A, Makradi A, Belouettar S, Ruch D, Muller R, Garmestani H, Toniazzo V, Ahzi S. Thermochi. Acta 2011, 520, 33–37.10.1016/j.tca.2011.02.037 ↗
5. Asiaei S, Khatibi AA, Baniasadi M, Safdari M. J. Reinf. Plast. Compos. 2010, 29, 818–829.10.1177/0731684408100701 ↗
6. Ghazavizadeh A, Baniassadi M, Safdari M, Atai A, Ahzi S, Patlazhan S, Gracio J, Ruch D. J. Comput. Theor. Nanosci. 2011, 8, 2087–2099.10.1166/jctn.2011.1930 ↗
7. Li DS, Baniassadi M, Garmestani H, Ahzi S, Reda Taha MM, Ruch D. J. Comput. Theor. Nanosci. 2010, 7, 1462–1468.10.1166/jctn.2010.1504 ↗
8. Lu JP. Phys. Rev. Lett. 1997, 79, 1297–1300.10.1103/PhysRevLett.79.1297 ↗
9. Agarwal A, Bakshi SR, Lahiri D. Carbon Nanotubes Reinforced Metal Matrix Composites, CRC Press Taylor & Francis Group: Boca Raton, 2011.
10. Ávila-Orta CA, Cruz-Delgado CA, Neira-Velázquez MG, Hernández-Hernández E, Méndez-Padilla MG, Medellín-Rodríguez FJ. Carbon 2009, 47, 1916–1921.10.1016/j.carbon.2009.02.033 ↗
11. Luo Y, Zhao Y, Cai J, Duan Y, Du S. Mater. Des. 2012, 33, 405–412.10.1016/j.matdes.2011.04.033 ↗
12. Meng L, Fu C, Lu Q. Prog. Nat. Sci. 2009, 19, 801–810.10.1016/j.pnsc.2008.08.011 ↗
13. Naseh MV, Khodadadi AA, Mortazavi Y, Pourfayaz F, Alizadeh O, Maghrebi M. Carbon 2010, 48, 1369–1379.10.1016/j.carbon.2009.12.027 ↗
14. O’Connell MJ, Boul P, Ericson LM, Huffman C, Wang Y, Haroz E, Kuper C, Tour J, Ausman KD, Smalley RE. Chem. Phys. Lett. 2001, 342, 265–271.10.1016/S0009-2614(01)00490-0 ↗
15. Sahraei AA, Fathi AA, Givi MKB, Boroun S, Pashaei MH. J. Compos. Mater. 2014, 48, 3485–3497.10.1177/0021998313510333 ↗
16. Cha SI, Kim KT, Arshad SN, Mo CB, Hong SH. Adv. Mater. 2005, 17, 1377–1381.10.1002/adma.200401933 ↗
17. Daoush WM, Lim BK, Mo CB, Nam DH, Hong SH. Mater. Sci. Eng. A 2009, 513–514, 247–253.10.1016/j.msea.2009.01.073 ↗
18. Kim C, Lim B, Kim B, Shim U, Oh S, Sung B, Choi J, Ki J, Baik S. Synth. Met. 2009, 159, 424–429.10.1016/j.synthmet.2008.10.017 ↗
19. Lin CB, Chang Z-C, Tung YH, Ko Y-Y. Wear 2011, 270, 382–394.10.1016/j.wear.2010.11.010 ↗
20. Rajkumar K, Aravindan S. Wear 2011, 270, 613–621.10.1016/j.wear.2011.01.017 ↗
21. Kim KT, Cha SI, Gemming T, Eckert J, Hong SH. Small 2008, 4, 1936–1940.10.1002/smll.200701223 ↗
22. Quinn BM, Dekker C, Lemay SG. J. Am. Chem. Soc. 2005, 127, 6146–6147.10.1021/ja0508828 ↗
23. Chen X, Xia J, Peng J, Li W, Xie S. Compos. Sci. Technol. 2000, 60, 301–306.10.1016/S0266-3538(99)00127-X ↗
24. Wang F, Arai S, Endo M. Electrochem. Commun. 2004, 6, 1042–1044.10.1016/j.elecom.2004.08.007 ↗
25. Knez M, Nielsch M, Niinistö L. Adv. Mater. 2007, 19, 3425–3438.10.1002/adma.200700079 ↗
26. Sahoo P, Das SK. Mater. Des. 2011, 32, 1760–1775.10.1016/j.matdes.2010.11.013 ↗
27. Chin KC, Gohel A, Chen WZ, Elim HI, Ji W, Chong GL, Sow CH, Wee ATS. Chem. Phys. Lett. 2005, 409, 85–88.10.1016/j.cplett.2005.04.092 ↗
28. Ang LM, Hor TSA, Xu GQ. Chem. Mater. 1999, 11, 2115–2118.10.1021/cm990078i ↗
29. Ang LM, Hor TSA, Xu GQ, Tung CH, Zhao SP, Wang JLS. Carbon 2000, 38, 363–372.10.1016/S0008-6223(99)00112-8 ↗
30. Xu L, Liao J, Huang L, Ou D, Guo Z, Zhang H, Ge C, Gu N, Liu J. Thin Solid Films 2003, 434, 121–125.10.1016/S0040-6090(03)00274-8 ↗
31. Peng Y, Chen Q. Colloids Surf. A 2009, 342, 132–135.10.1016/j.colsurfa.2009.04.030 ↗
32. Bindra P, White JR. Fundamental aspects of electroless copper plating. In Electroless Plating Fundamentals & Applications, Mallory GO, Hajdu JB, Eds., William Andrew/Noyes: New York, 1990, pp. 289–375.
33. Alizadeh Sahraei A, Fathi A, Besharati Givi M, Pashaei M. Appl. Phys. A 2014, 116, 1677–1686.10.1007/s00339-014-8300-z ↗
34. Torabi Merajin M, Mosavi Mashhadi M, Alizadeh Sahraei A. J. Compos. Mater. 2013.
35. Kuznetsova A, Popova I, Yates JT Jr, Bronikowski MJ, Huffman CB, Liu J, Smalley RE, Hwu HH, Chen JG. J. Am. Chem. Soc. 2001, 123, 10699–10704.10.1021/ja011021b ↗
36. Yu Z, Brus LE. J. Phys. Chem. A 2000, 104, 10995–10999.10.1021/jp002197n ↗
37. Imam MA, Zeng Q, Bayazitoglu Y, Wilson K, Barrera EV, Luna J. Mater. Sci. Forum 2007, 655–658.10.4028/0-87849-462-6.655 ↗
38. Rao GP, Lu C, Su F. Sep. Purif. Technol. 2007, 58, 224–231.10.1016/j.seppur.2006.12.006 ↗
39. Stobinski L, Lesiak B, Kövér L, Tóth J, Biniak S, Trykowski G, Judek J. J. Alloys Compd 2010, 501, 77–84.10.1016/j.jallcom.2010.04.032 ↗
40. Goyanes S, Rubiolo GR, Salazar A, Jimeno A, Corcuera MA, Mondragon I. Diamond Relat. Mater. 2007, 16, 412–417.10.1016/j.diamond.2006.08.021 ↗
41. Terzyk AP, Gauden PA, Kowalczyk P. Carbon Materials: Theory and Practice, Research Signpost, Kerala, India, 2008.
42. Park M, Kim B-H, Kim S, Han D-S, Kim G, Lee K-R. Carbon 2011, 49, 811–818.10.1016/j.carbon.2010.10.019 ↗
43. Xu C, Wu G, Liu Z, Wu D, Meek TT, Han Q. Mater. Res. Bull. 2004, 39, 1499–1505.10.1016/j.materresbull.2004.04.021 ↗
44. Paunovic M. Electroless deposition of copper. In Modern Electroplating, Schlesinger M, Paunovic M, Eds., John Wiley & Sons Inc.: Hoboken, NJ, 2010, pp. 433–446.10.1002/9780470602638.ch17 ↗
45. Maghrebi M, Khodadadi AA, Mortazavi Y, Mhaisalkar S. Appl. Surf. Sci. 2009, 255, 7243–250.10.1016/j.apsusc.2009.03.074 ↗