Using genetic algorithms to detect interfacial cracks on the basis of the thermal resistance of multilayer materials
Source abstract
Abstract
To address the heat-conduction problem of multilayer materials for thermal contact resistance, this paper proposes an innovative solution: the finite element method. The direct heat-conduction problem can be regarded as a virtual element for thermal contact resistance. There is hardly any error between the result generated from the finite element method and those generated from the analytic method and the analog resistance method. For an inverse heat-conduction problem, on the basis of the consideration that air may enter to form the thermal resistance once a material cracks, GAMAS [1] (genetic algorithms based on migration and artificial selection) and the finite element method are used to simulate the transient temperature on the boundary and, plus a temperature measurement error, detect the location where the multilayer materials crack inversely and correctly.
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Research context
OpenAlex topics: Diverse Industrial Engineering Technologies · Industrial Engineering and Technologies · Engineering Technology and Methodologies
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References (14)
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