Analyzing flaws in electric components by scanning acoustic microscopy
Source abstract
Abstract
Flaws that occur due to the following processes involved in the production of electronic components have been examined: soldering of crystals to pack bases; assembly of flip-chips; and sealing of integrated circuits with a plastic. The analysis has been performed by scanning acoustic microscopy.
Source: openalex_inverted_index · Quality: baseline
Research context
OpenAlex topics: Integrated Circuits and Semiconductor Failure Analysis · Electronic Packaging and Soldering Technologies · Non-Destructive Testing Techniques
SciVX discovery tags are terminology-based. OpenAlex topics are source-provided classifications.
References (6)
Show source-provided references
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