The reliability of soldered joints produced at a low temperature
Source abstract
Abstract
Under severe service conditions of electronic instruments (at elevated temperatures and vibrations in electronic systems), failures in their operation frequently occur. Severe intrinsic thermal conditions of operating instruments may cause such failures. However, malfunctions in electronic devices may often be due to defects in soldered joints that were made at lowered temperatures. An approach is proposed that makes it possible to considerably improve the reliability of soldered joints.
Source: openalex_inverted_index · Quality: baseline
Research context
OpenAlex topics: Material Properties and Applications · Engineering Technology and Methodologies · Diverse Industrial Engineering Technologies
SciVX discovery tags are terminology-based. OpenAlex topics are source-provided classifications.
References (11)
Show source-provided references
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