Developing a Speckle Pattern to Evaluate Adhesive Joints Using Digital Image Correlation
Source abstract
Abstract
Digital Image Correlation (DIC) is a known Non-Destructive Evaluation (NDE) method used in various industries. DIC requires a randomly produced pattern, known as speckle pattern, to track and generate strain maps. The speckle patterns are fundamental for DIC applications. DIC uses images of these speckle patterns before and after a load has been applied to generate strain maps by comparing the changes between speckle pattern images. In this study, a speckle pattern is sought to implement within adhesive joints. The speckle pattern must be trackable using ultrasonic imaging; therefore, it is chosen from materials with high acoustic impedance metals. By tracking the speckle pattern and using DIC, defects within joints will be revealed. This allows non-destructive analysis to be conducted on adhesive joints to detect defects which may go undetected using conventional ultrasonic techniques.
Source: openalex_inverted_index · Quality: baseline
Research context
OpenAlex topics: Optical measurement and interference techniques · Ultrasonics and Acoustic Wave Propagation · Thermography and Photoacoustic Techniques
SciVX discovery tags are terminology-based. OpenAlex topics are source-provided classifications.
Affiliations
Department of Mechanical Engineering, University of Maryland, College Park, Maryland, USA
Mechanical Engineering and Energy Processes, Southern Illinois University Carbondale, Carbondale, Illinois, USA
References (31)
Show source-provided references
1. Waugh R. C. · Adv. Exp. Mech · 2011 · 369
2. 10.1016/j.ijadhadh.2010.06.00510.1016/j.ijadhadh.2010.06.005 ↗
3. Marty P. N. · 2004
4. 10.1080/0021846860807494310.1080/00218468608074943 ↗
5. Chambers J. K. · Insight · 1999 · 3 · 151
6. 10.1163/156856191X0052110.1163/156856191X00521 ↗
7. 10.1016/S1359-8368(99)00026-810.1016/S1359-8368(99)00026-8 ↗
8. 10.1080/0021846870807497510.1080/00218468708074975 ↗
9. 10.1016/S0041-624X(03)00156-210.1016/S0041-624X(03)00156-2 ↗
10. 10.1007/BF0232509210.1007/BF02325092 ↗
11. 10.1016/j.aei.2012.06.00610.1016/j.aei.2012.06.006 ↗
12. 10.1023/A:102258482273010.1023/A:1022584822730 ↗
13. Tsangouri E. · 2014
14. 10.3390/s14040739410.3390/s140407394 ↗
15. 10.1016/0262-8856(86)90057-010.1016/0262-8856(86)90057-0 ↗
16. 10.1007/BF0232269510.1007/BF02322695 ↗
17. 10.1007/BF0232355510.1007/BF02323555 ↗
18. 10.1007/BF0232248810.1007/BF02322488 ↗
19. 10.1016/j.ijadhadh.2013.01.00410.1016/j.ijadhadh.2013.01.004 ↗
20. 10.1111/j.1747-1567.2002.tb00087.x10.1111/j.1747-1567.2002.tb00087.x ↗
21. 10.12989/sem.2008.29.1.11310.12989/sem.2008.29.1.113 ↗
22. M. A. Hamed, and T. C. Chu (1985). Ultrasonic displacement measurements using digital correlation. In: 1985 SEM Spring Conference on Experimental Mechanics, Las Vegas, NV, June 9-14, 1985, Proceedings (A86-34601 15-39). Brookfield Center, CT, Society for Experimental Mechanics, Inc., 1985, p. 819-822. (pp. 819-822).
23. A. A. Hassen, A. Poudel, T. P. Chu, M. Yester, and U. K. Vaidya (2014, October). Tracing defects in glass fiber/polypropylene composites using ultrasonic c-scan and X-ray computed tomography methods. In ASNT Annual Conference 2014 (pp. 72-79).Charleston, SC
24. N. R. Center, “Acoustic Impedance,” Available: www.nde-ed.org. 2016.
25. 10.1016/j.ijadhadh.2009.12.00310.1016/j.ijadhadh.2009.12.003 ↗
26. Bak K. · Insight · 2013 · 55
27. ASTM D 3163 Standard.
28. 10.2478/v10254-012-0008-x10.2478/v10254-012-0008-x ↗
29. C. Lane, R. L. Burguete, and A. Shterenlikht (2008, June). An objective criterion for the selection of an optimum dic pattern and subset size. In Proceedings of the XIth international congress and exposition (pp. 1-9). Orlando, Florida, USA
30. S. K. Nash-Stevenson, G. Karr, L. M. Freeman, and J. Bland (2004). The 2003 NASA Faculty Fellowship Program Research Reports.
31. 10.1007/s11340-015-0009-110.1007/s11340-015-0009-1 ↗