journal article·2024-05-10

Lattice Architectures for Thermoelectric Energy Harvesting

Danwei Zhang, Natalie Ngoh Yen Qi, Samantha Faye Duran Solco, Xinwei Li, Ady Suwardi

ACS Energy Letters· Volume 9· Issue 5
Publisher page

Abstract

Tapping on waste heat for green electricity is a welcomed goal, especially in an energy-scarce era. For more than 200 years, the optimization of thermoelectric modules has been through either materials efficiency or device topology (fill factor, aspect ratio, etc.). Now, there is a pressing need for a re-examination of its design for higher power performance modules. Specifically, there have been recent reports on the potential of leg geometries for increased output power, but progress is hampered by current leg fabrication methods. In this Perspective, we offer a fresh take on how lattice architectural thermoelectric legs are a cost-effective strategy that can drastically improve power output. We will discuss the extent to which lightweight lattice legs can improve output power and the trade-offs with mechanical performance and conclude with strategies to realize them for industrial applications.
Source: openalex_inverted_index · Quality: baseline

Research context

OpenAlex topics: Advanced Thermoelectric Materials and Devices · Energy Harvesting in Wireless Networks · Thermal Radiation and Cooling Technologies

SciVX discovery tags are terminology-based. OpenAlex topics are source-provided classifications.

Affiliations

Institute of Materials Research and Engineering (IMRE), Agency for Science, Technology and Research (A*STAR), 2 Fusionopolis Way, Innovis, #08-03 Singapore 138634, Singapore

Department of Materials, Royal School of Mines, Imperial College London, Exhibition Road, London SW7 2AZ, United Kingdom

Faculty of Science, Agriculture, & Engineering, Newcastle University in Singapore, Singapore 567739, Singapore

Department of Materials Science and Engineering, National University of Singapore (NUS), 9 Engineering Drive 1, #03-09 EA, Singapore 117575, Singapore

Department of Electronic Engineering, The Chinese University of Hong Kong, New Territories, Hong Kong SAR 999077, China

Funding

Agency for Science, Technology and Research

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