Copper plating on and electrical investigation of a low-permittivity cycloolefin-copolymer
Source abstract
Abstract
Abstract Adhesive (>5 MPa) and conductive (ρ~2 μΩ cm) copper films with a thickness of ~200 nm were deposited by chemical means on a recently developed low- k cycloolefin-copolymer (COC). The steps of the metallization procedure (chemical etching, metal seeding and copper plating) were optimized. Raman spectroscopy, SEM and AFM were used in the investigation of surface structures formed in the course of processing. Since this polymer is a good candidate for high-frequency microelectronics applications, electrical measurements up to 3 GHz were performed as well.
Source: openaire · Quality: candidate unverified · Source record ↗
Research context
OpenAlex topics: Copper Interconnects and Reliability · Synthesis and properties of polymers · Molecular Junctions and Nanostructures
SciVX discovery tags are terminology-based. OpenAlex topics are source-provided classifications.
References (14)
Show source-provided references
1. Low dielctric constant materials for ULSI interconnects10.1146/annurev.matsci.30.1.645 ↗
2. Copper metallization for advanced IC: requirements and technological solutions10.1016/S0167-9317(99)00307-X ↗
3. Low dielectric constant polymers for microelectronics10.1016/S0079-6700(00)00043-5 ↗
4. Topas® COC datasheet by Ticona GmbH, Germany. 2000.
5. Chemistry of materials metallization
6. Surface activation of polyimide with dielectric barrier discharge for electroless metal deposition10.1016/S0257-8972(99)00564-2 ↗
7. Excimer laser treatment of PET before plazma metallization10.1016/S0169-4332(00)00765-0 ↗
8. Pretreatment by laser radiation and its effect on adhesion in the metallization of poly(butylene terephthalate)10.1163/156856197X00606 ↗
9. Furness · 1968
10. Lowenheim · 1974
11. Kinetic study of 222 nm excimer lamp induced decomposition of palladium-acetate films10.1016/S0169-4332(98)00432-2 ↗
12. Laser-assisted seeding for electroless plating on polyimide surfaces10.1149/1.2048563 ↗
13. UV laser-induced liquid-phase palladium seeding on polymers10.1557/JMR.1999.0498 ↗
14. Laser-assisted metal deposition from liquid-phase precursors on polymers10.1016/S0169-4332(00)00852-7 ↗