Performance of high-temperature thermosetting polyimide composites modified with thermoplastic polyimide
Source abstract
Abstract
Abstract The preparation of polyimide (PI) resin with high heat resistance and toughness is a significant challenge. In this study, thermoplastic PI (TPI) was used to toughen thermosetting PIs, and toughened PI (TPI/PI) blends were prepared. The modified PI resin system exhibited good thermal stability, excellent heat resistance, and high toughness. The results indicated that the TPI/PI blends maintained the curing behavior and characteristics of the PI oligomer. The Tg of the cured TPI/PI blend exceeded 395 °C, and the T5% values were in the range of 533–563 °C, suggesting excellent thermal stability and heat resistance. The maximum impact strength was increased by 46% compared with that of pure PI, indicating the excellent toughening effect of the TPI. Carbon fiber-reinforced PI composites were prepared using the toughening system as a matrix. The compression-after-impact values of the carbon fiber-reinforced PI composites were up to 190 MPa, indicating the excellent toughness of the materials.
Source: openaire · Quality: candidate unverified · Source record ↗
Research context
OpenAlex topics: Synthesis and properties of polymers · Tribology and Wear Analysis · Epoxy Resin Curing Processes
SciVX discovery tags are terminology-based. OpenAlex topics are source-provided classifications.
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