Polymer-Matrix Composites for Microelectronics
Source abstract
Abstract
Polymer-matrix composite materials for microelectronics are reviewed in terms of the science and applications. They include those with continuous and discontinuous fillers in the form of particles and fibres, as designed for high thermal conductivity, low thermal expansion, low dielectric constant, highllow electrical conductivity and electromagnetic interference shielding. Applications include heat sinks, housings, printed wiring boards, substrates, lids, die attach, encapsulation, interconnections and thermal interface materials.
Source: crossref · Quality: baseline
Research context
OpenAlex topics: Material Properties and Applications · Dielectric materials and actuators · Epoxy Resin Curing Processes
SciVX discovery tags are terminology-based. OpenAlex topics are source-provided classifications.
Affiliations
Composite Materials Research Laboratory, State University of New York at Buffalo, Buffalo, New York 14260-4400, USA
References (92)
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