Reliability Design and Optimization Process on through Mold via using Ultrafast Laser
Source abstract
Abstract
In this study, a through mold via (TMV) process using ultrafast Laser has been developed for the interconnection on 3D package-on-package (PoP) application. Epoxy molding compound (EMC) is a composite material consisted of epoxy resin, filler particles (fused silica) and other constituents. Among these chemical compositions, the size and spatial distribution of fillers on the EMC dominate the sidewall quality on drilled trench. However, random filler leakage on the sidewall leads to an irregular and uneven trench and these drop out fillers become a problem needed to be solved. Faster removal of debris can be achieved by controlling the laser drilling parameters. Parametric studies have been performed to determine the specification of trench and design rule of material. The optimal desmear process on TMV bottom PoP package developed in this study demonstrates the reliability improvement on follow-up sputtering or filling process.
Source: crossref · Quality: baseline
Research context
OpenAlex topics: 3D IC and TSV technologies · Additive Manufacturing and 3D Printing Technologies · Electronic Packaging and Soldering Technologies
SciVX discovery tags are terminology-based. OpenAlex topics are source-provided classifications.
Affiliations
Department of Mechanical and Computer-Aided Engineering, St. John University, New Taipei City 25135, Taiwan, ROC
Department of Industrial Management, I-Shou University, Kaohsiung City 84001, Taiwan, ROC
Department of Mechanical and Automation Engineering, I-Shou University, Kaohsiung City 84001, Taiwan, ROC
Department of Material Science and Engineering, I-Shou University, Kaohsiung City 84001, Taiwan, ROC
References (12)
Show source-provided references
1. KimJ., LeeK., ParkD., HwangT., KimK., KangD., KimJ., LeeC., ScanlanC., BerryC.J., ZwengerC., SmithL., DreizaM., and DarveauxR. “Application of through mold via (TMV) as PoP base package,” 58 th Electronic Components and Technology Conference (ECTC 2008), Orlando, FL, USA, May 27–30, 2008, pp. 1089–1092.10.1109/ECTC.2008.4550110 ↗
2. ZwengerC., and SmithL. “Next Generation Package-on-Package (PoP) Platform with Through Mold Via (TMV™) Interconnection Technology,” IMAPS Device Packaging Conference, Scottsdale, AZ, USA, Mar. 10–12, 2009.
3. YoshidaA., WenS.M., LinW., KimJ.Y., and IshibashiK. “A study on an Ultra Thin PoP using through mold via technology,” 61 st Electronic Components and Technology Conference (ECTC 2011), Orlando, FL, USA, May 31-June 3, 2011, pp. 1547–1551.10.1109/ECTC.2011.5898716 ↗
4. BraunT., BrμndelM., BeckerK.F., KahleR., PiefkeK., ScholzU., HaagF., BaderV., VogesS., ThomasT., AschenbrennerR., LangK.D. “Through mold via technology for multi-sensor stacking,” 14 th Electronics Packaging Technology Conference (EPTC 2012), Singapore, Dec. 5–7, 2012.10.1109/EPTC.2012.6507099 ↗
5. Bottom PoP Technologies, http://www.amkor.com/go/Packageon-Package.
6. Lin Y.C. · International Journal of Engineering and Technology Innovation (IJETI) · 2012 · 2 · 184
7. 10.1109/TCAPT.2006.87587410.1109/TCAPT.2006.875874 ↗
8. 10.1007/s13391-013-0011-710.1007/s13391-013-0011-7 ↗
9. ChengH.H., LeeC.C., ChungM.F., PanP.C., YangP.F., ChiuC.T., HungC.P., and WangC.C. “Next generation package-on-package solution to support wide IO and high bandwidth interface,” 64 th Electronic Components and Technology Conference (ECTC 2014), Orlando, FL, USA, May 27–30, 2014, pp. 2112–2118.10.1109/ECTC.2014.6897594 ↗
10. LinY.J., KangC., ChuaL., ChoiW.K., and YoonS.W. “Advanced 3D eWLB-PoP (Embedded Wafer Level Ball Grid Array - Package on Package) Technology,” 66 th Electronic Components and Technology Conference (ECTC 2016), Las Vegas, NV, USA, May 31-Jun. 3, 2016, pp. 1772–1777.10.1109/ECTC.2016.257 ↗
11. HsiehM.C., KangK.T., ChoiH.C., and KimY.C. “Thin profile flip chip package-on-package development,” 11 th International Microsystems, Packaging, Assembly and Circuits Technology Conference (IMPACT 2016), Taipei, Taiwan, Oct. 26–28, 2016, pp. 143–147.10.1109/IMPACT.2016.7799981 ↗
12. HsuH.C., WuS.J., LinW.F., HsiC.S., PaoH.Y., WangP.C. “Through Mold Via (TMV) by gas-aided laser,” International Conference on Electronics Packaging (ICEP 2016), Sapporo, Japan, Apr. 20–22, 2016, pp. 593–596.10.1109/ICEP.2016.7486897 ↗