The effect of BN/Al 2 O 3 in-situ self-assembling on thermal conductivity of polypropylene composites
Source abstract
Abstract
In this work, γ-aminopropyltriethoxy silane (KH550) and γ-(2,3-epoxypropoxy)propyltrimethoxy silane (KH560) were used to modify BN and Al 2 O 3 , and described as KH550-BN and KH560-Al 2 O 3 with amino and epoxy group on surface, respectively. KH550-BN and KH560-Al 2 O 3 were filled in polypropylene (PP) matrix by twin-screw extruder. The thermal conductivity of composites increased with increasing catalyst dosage, material residence time in barrel and homogenization section temperature of twin-screw extruder. Hybrid fillers with semi core-shell structure were formed by KH550-BN in-situ reacting with KH560-Al 2 O 3 though amino and epoxy group. KH550-BN and KH560-Al 2 O 3 were pre-assembled in toluene and filled into PP to prepare composites, which thermal conductivity increased with increasing pre-assembling time. The experimental results show that KH550-BN and KH560-Al 2 O 3 do in-situ self-assemble in PP melt. The thermal conductivity of composites with in-situ self-assembling had 21.6% improvement than that of composites with no assembling. A low-cost, simple and efficient method for preparing thermally conductive and insulating composites is realized.
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Research context
OpenAlex topics: Thermal properties of materials · Fiber-reinforced polymer composites · Tribology and Wear Analysis
SciVX discovery tags are terminology-based. OpenAlex topics are source-provided classifications.
Affiliations
School of Chemistry and Chemical Engineering, Hefei University of Technology, Hefei, The People’s Republic of China
Funding
Funding of Anhui Science and Technology Department
References (18)
Show source-provided references
1. 10.1016/j.progpolymsci.2010.11.00410.1016/j.progpolymsci.2010.11.004 ↗
2. 10.1111/j.1151-2916.2002.tb00183.x10.1111/j.1151-2916.2002.tb00183.x ↗
3. Wang H · Polym Polym Compos · 2019 · 28 · 421
4. 10.3390/ma1316363410.3390/ma13163634 ↗
5. 10.1088/2053-1591/aac92d10.1088/2053-1591/aac92d ↗
6. 10.1002/adfm.20080143510.1002/adfm.200801435 ↗
7. 10.1016/j.ceramint.2016.02.09810.1016/j.ceramint.2016.02.098 ↗
8. 10.1007/s40820-020-00548-510.1007/s40820-020-00548-5 ↗
9. 10.1016/j.compscitech.2021.10869310.1016/j.compscitech.2021.108693 ↗
10. 10.3390/nano1009168210.3390/nano10091682 ↗
11. 10.1016/j.ijheatmasstransfer.2021.12114510.1016/j.ijheatmasstransfer.2021.121145 ↗
12. 10.1016/j.compscitech.2021.10879910.1016/j.compscitech.2021.108799 ↗
13. 10.1002/pen.2571410.1002/pen.25714 ↗
14. 10.1063/5.004240410.1063/5.0042404 ↗
15. 10.1016/j.compscitech.2020.10838510.1016/j.compscitech.2020.108385 ↗
16. 10.1002/app.2750510.1002/app.27505 ↗
17. 10.1002/pola.2174210.1002/pola.21742 ↗
18. 10.1016/j.compscitech.2019.04.02710.1016/j.compscitech.2019.04.027 ↗