journal article·2011-06Open access

Investigation of the Curing Kinetics and Rheological Behavior of Multifunctional Epoxy Resin System

Zhou Zhengwei, Bai Ruicheng, Ren Musu, Sun Jinliang, Zhou Ze, Hu Qingping, Wang Chuanbin

Polymers and Polymer Composites· Volume 19· Issue 4-5

Abstract

The curing reactivity and viscosity of AG-70 epoxy resin system with MNA as the curing agent and 2,4-EMI as the accelerator promoter were measured by using non-isothermal differential scanning calorimetry (DSC) and RS600 Rotational Rheometer, respectively. According to the DSC curves at different heating rates, the curing parameters such as the gelation temperature, the peak temperature and the treat temperature were obtained by using T-β curve extrapolation, the kinetic parameters of the curing reaction were determined by using Kissinger, Ozawa and Crane equation, including the apparent activation energy, the pre-exponential frequency and the curing reaction order. Then the kinetic model based on an nth order reaction equation was set up. The experimental data of the viscosity behavior were analyzed, and modified dual-Arrhenius viscosity model was established to predict the isothermal rheological behavior. The relationship between gel-time and temperature was also analyzed.
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Research context

OpenAlex topics: Epoxy Resin Curing Processes · Injection Molding Process and Properties · Synthesis and properties of polymers

SciVX discovery tags are terminology-based. OpenAlex topics are source-provided classifications.

Affiliations

Composite Materials Research Center, Shanghai University, Shanghai 200072, China

Far East Holding Group Co., Ltd, Jiangsu 214257, China

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