Expandable Preparation of Flexible Composites via Hot-Melt Adhesive Fiber Films for Integrated Electromagnetic Protection and Thermal Management

Advanced EMI shielding materials with superior thermal management capabilities and flexibility are critically needed to address the increasingly complex service conditions of modern applications, especially in precision electronics. A principal challenge in material design lies in balancing electromagnetic performance, thermal management, flexibility, and thickness. A flexible ternary composite material was fabricated, integrating a hot-melt adhesive fiber mesh, modified carbon-based fillers, and poly(ether ether ketone) film. This strategy synergistically leverages the multiscale fillers and the interlaced network of the hot melt adhesive fiber mesh to construct a continuous three-dimensional filler network. This hierarchical assembly circumvents the traditional strength-toughness trade-off while imparting multifunctionality. The flexible film retains the advantageous flexibility and achieves an outstanding electromagnetic interference shielding efficiency of 86 dB (8.2–12.4 GHz) and an in-plane thermal conductivity of 34 W m –1 K –1 . Furthermore, it exhibits exceptional electro-/opto-thermal conversion capabilities, achieving rapid Joule heating (217 °C at 3 V) and efficient photothermal conversion (141 °C under 500 mW/cm 2 ). This work presents a manufacturing-friendly and facile approach based on solvent-free consolidation to developing flexible materials integrating mechanical durability, EMI shielding, and thermal management for next-generation precision electronics.