Designing Rigid–Flexible Epoxy Resins to Unlock Shape Memory and Enhance Toughness
Source abstract
Abstract
It remains a challenge to balance the trade-off between toughness, stiffness, and shape memory properties in shape memory epoxy resins (SMEP). In this study, we employed molecular engineering to synthesize stiff–flexible SMEP, by reacting furan-containing epoxy monomers 2,5-bis[(2-epoxymethoxy)methyl]furan (BOF), derived from biomass, with amines containing imine-amine (IA) and 4,4′-dithiodiphenylamine (4-DTDA). The results indicate that the sacrificial hydrogen bonding and the necessary flexible segments confer BOF/4-DTDA/IA (BDI) with a toughness of up to 13.9 MJ/m 3 and a stiffness of 3.5 GPa. Furthermore, the introduction of hyperbranched epoxy resin (HER) yields BOF/4-DTDA/IA/HER (BDIH), which maintains a stiffness exceeding 2 GPa while retaining a toughness of 11.2 MJ/m 3 . Additionally, BDIH exhibits enhanced tensile strength with an increasing strain rate, which we rationalize based on the loss modulus and scanning electron microscopy morphology analyses. The collaborative motion of the rigid–flexible chain segments and the hydrogen bonding contributes to BDI’s excellent shape memory performance (shape fixation ratio ( R f = 99.00%) and shape recovery ratio ( R r = 99.15%). The physical barrier effect and flexibility of the HER further enhance the shape memory properties. In conclusion, the mechanical features and shape memory performance of BDI and BDIH demonstrate the significant potential for applications in smart molds, smart devices, and other advanced technologies.
Source: openalex_inverted_index · Quality: baseline
Research context
OpenAlex topics: Polymer composites and self-healing · Advanced Sensor and Energy Harvesting Materials · Advanced Materials and Mechanics
SciVX discovery tags are terminology-based. OpenAlex topics are source-provided classifications.
Affiliations
State Key Laboratory of Solid Lubrication
Lanzhou Institute of Chemical Physics, Chinese Academy of Sciences
Center of Materials Science and Optoelectronics Engineering
University of Chinese Academy of Sciences
Funding
National Key Research and Development Program of China · Science and Technology Program of Gansu Province · National Natural Science Foundation of China · Chinese Academy of Sciences · Aerospace Science and Technology Application Innovation Plan-Hui Yan XD, Wen Hao Tian Scientific Research
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