Reactive Molecular Dynamics Simulation of Epoxy for the Full Cross-Linking Process
Source abstract
Abstract
Epoxy resins are used extensively in composite materials for a wide range of engineering applications, including structural components of aircraft and spacecraft. The processing of fiber-reinforced epoxy composite structures requires carefully selected heating and cooling cycles to fully cure the resin and form strong cross-linked networks. To fully optimize the processing parameters for effective epoxy monomer cross-linking and final product integrity, the evolution of mechanical properties of epoxies during processing must be comprehensively understood. Because the full experimental characterization of these properties as a function of degree of cure is difficult and time-consuming, efficient computational predictive tools are needed. The objective of this research is to develop an experimentally validated Molecular Dynamics (MD) modeling method, which incorporates a reactive force field, to accurately predict the thermo-mechanical properties of an epoxy resin as a function of the degree of cure. Experimental rheometric and mechanical testing are used to validate an MD model, which is subsequently used to predict mass density, shrinkage, elastic properties, and yield strength as a function of the degree of cure. The results indicate that each of the physical and mechanical properties evolve uniquely during the cross-linking process. These results are important for future processing modeling efforts.
Source: openalex_inverted_index · Quality: baseline
Research context
OpenAlex topics: Epoxy Resin Curing Processes · Polymer crystallization and properties · Fiber-reinforced polymer composites
SciVX discovery tags are terminology-based. OpenAlex topics are source-provided classifications.
Affiliations
Michigan Technological University, Houghton, Michigan 49931, United States
University of Massachusetts, Lowell, Massachusetts 01854, United States
Funding
National Aeronautics and Space Administration
References (58)
Show source-provided references
1. 10.1016/j.jiec.2015.03.02610.1016/j.jiec.2015.03.026 ↗
2. Brostow W. · 2014 · 19110.1016/B978-1-4557-3107-7.00008-7 ↗
3. 10.1002/polb.2348910.1002/polb.23489 ↗
4. 10.1021/acs.macromol.8b0183610.1021/acs.macromol.8b01836 ↗
5. 10.1016/j.commatsci.2020.10997010.1016/j.commatsci.2020.109970 ↗
6. 10.1016/j.compositesb.2021.10867210.1016/j.compositesb.2021.108672 ↗
7. 10.1016/j.polymer.2011.03.05210.1016/j.polymer.2011.03.052 ↗
8. 10.1016/j.compscitech.2013.01.00210.1016/j.compscitech.2013.01.002 ↗
9. 10.1016/j.jmgm.2007.12.00110.1016/j.jmgm.2007.12.001 ↗
10. 10.1021/ma801153e10.1021/ma801153e ↗
11. 10.1016/j.ijplas.2013.01.00410.1016/j.ijplas.2013.01.004 ↗
12. 10.1016/j.polymer.2017.12.05510.1016/j.polymer.2017.12.055 ↗
13. 10.1016/j.polymer.2010.10.03310.1016/j.polymer.2010.10.033 ↗
14. 10.1016/j.polymer.2011.04.04110.1016/j.polymer.2011.04.041 ↗
15. 10.1016/j.polymer.2015.08.03710.1016/j.polymer.2015.08.037 ↗
16. 10.1039/C8SM02071J10.1039/C8SM02071J ↗
17. 10.1016/j.compositesa.2014.07.00210.1016/j.compositesa.2014.07.002 ↗
18. 10.1016/j.commatsci.2017.11.00710.1016/j.commatsci.2017.11.007 ↗
19. 10.1142/S0219581X0600417610.1142/S0219581X06004176 ↗
20. 10.1016/j.polymer.2013.04.03410.1016/j.polymer.2013.04.034 ↗
21. 10.1021/ma300758710.1021/ma3007587 ↗
22. 10.1016/j.jmgm.2015.09.01210.1016/j.jmgm.2015.09.012 ↗
23. 10.1021/ma900400710.1021/ma9004007 ↗
24. 10.1016/j.commatsci.2019.10946910.1016/j.commatsci.2019.109469 ↗
25. 10.1021/acs.jpca.8b0382610.1021/acs.jpca.8b03826 ↗
26. 10.1002/polb.2453910.1002/polb.24539 ↗
27. 10.1016/j.cplett.2013.11.03610.1016/j.cplett.2013.11.036 ↗
28. Winetrout J. J. · arXiv/cond-mat.mtrl-sci · 2021
29. 10.1021/la303884610.1021/la3038846 ↗
30. 10.1021/acs.jpcc.1c0341010.1021/acs.jpcc.1c03410 ↗
31. Odegard G. M. · arXiv/cond-mat.mtrl-sci · 2021
32. Shah S. · 2019 · 2732
33. 10.2514/6.2020-088210.2514/6.2020-0882 ↗
34. 10.3390/polym1315249110.3390/polym13152491 ↗
35. Patil, S. U.; Shah, S. P.; Deshpande, P. P.; Kashmari, K.; Odegard, G. M.; Maiaru, M. Prediction Of Residual Stress Build-Up In Polymer Matrix Composite During Cure Using A Two-Scale Approach. Proceedings of the American Society for Composites–Thirty-fourth Technical Conference, 2019.10.12783/asc34/31378 ↗
36. Patil, S. U.; Shah, S. P.; Deshpande, P. P.; Kashmari, K.; Olaya, M. N., Odegard, G. M.; Maiaru, M. Multi-scale Approach to Predict Cure-Induced Residual Stresses in an Epoxy System, Proceedings of the American Society for Composites–Thirty-fifth Technical Conference, Virtual, 2020.10.12783/asc35/34890 ↗
37. Deshpande, P. P.; Shah, S. P.; Patil, S. U.; Kashmari, K.; Olaya, M. N.; Odegard, G. M.; Maiarù, M. Multiscale Modelling of the Cure Process in Thermoset Polymers using ICME. Proceedings of the American Society for Composites─Thirty-fifth Technical Conference, Virtual, 2020.10.12783/asc35/34889 ↗
38. 10.1006/jcph.1995.103910.1006/jcph.1995.1039 ↗
39. 10.1080/0026897840010120110.1080/00268978400101201 ↗
40. 10.1063/1.44733410.1063/1.447334 ↗
41. 10.1103/PhysRevA.31.169510.1103/PhysRevA.31.1695 ↗
42. 10.1002/polb.2453910.1002/polb.24539 ↗
43. 10.1016/j.polymer.2017.09.03810.1016/j.polymer.2017.09.038 ↗
44. 10.1088/0965-0393/18/1/01501210.1088/0965-0393/18/1/015012 ↗
45. Flory P. J. · 1953
46. 10.1016/j.polymer.2012.08.04510.1016/j.polymer.2012.08.045 ↗
47. 10.1016/j.polymer.2018.02.06210.1016/j.polymer.2018.02.062 ↗
48. Malvern L. E. · 1969
49. 10.1007/s11340-015-0009-110.1007/s11340-015-0009-1 ↗
50. Harilal, R.; Ramji, M. Adaptation of Open Source 2D DIC Software Ncorr for Solid Mechanics Applications. 9th International Symposium on Advanced Science and Technology in Experimental Mechanics, 2014.
51. 10.1002/pen.1007110.1002/pen.10071 ↗
52. 10.2514/6.2021-188910.2514/6.2021-1889 ↗
53. OriginLab Corporation · 2020
54. 10.1002/pc.2413710.1002/pc.24137 ↗
55. 10.1177/002199831452267410.1177/0021998314522674 ↗
56. Miller-Stephenson.com Product Bulletin; pp 1–11.
57. 10.1061/(ASCE)0893-1321(2008)21:3(162)10.1061/(ASCE)0893-1321(2008)21:3(162) ↗
58. 10.1061/(ASCE)0893-1321(2007)20:2(75)10.1061/(ASCE)0893-1321(2007)20:2(75) ↗