Cu3Sn suppression criterion for solid copper/molten tin reaction
Source abstract
Abstract
AbstractThe formation of Cu3Sn phase in the soldering reaction is believed to be harmful for the reliability of solder contacts on account of Kirkendall voiding in the compound. In this study, a criterion for the suppression of the growth of this phase by the fast growing scallop-like Cu6Sn5 compound is presented. The average thickness of the η-Cu6Sn5 phase above which the ε-Cu3Sn phase starts to grow as a continuous layer at the Cu/Cu6Sn5 interface during liquid Sn/solid Cu interaction has been evaluated from thermodynamic and kinetic considerations.Keywords: solid phase reactionsdiffusionthermodynamicsinterfacessolderingphase competition AcknowledgementOne of the authors (AMG) is grateful to the Ministry of Education and Science and the State Fund for Fundamental researches (Ukraine) for partial support.
Source: openalex_inverted_index · Quality: baseline
Research context
OpenAlex topics: Electronic Packaging and Soldering Technologies · 3D IC and TSV technologies · Metallurgical and Alloy Processes
SciVX discovery tags are terminology-based. OpenAlex topics are source-provided classifications.
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