Multifunctional Nanocomposites-Based Modulation of Interfacial Interactions for Electrical Device Encapsulation

The third generation of electronic devices is characterized by integration, high frequency, and high efficiency. These advancements create an urgent demand for multifunctional packaging materials that exhibit crack resistance and effective thermal conductivity. This study proposes a strategy to modulate local interactions in multifunctional nanocomposite by adjusting component composition, ultimately inhibiting crack formation, enhancing heat dissipation, and ensuring uniform electric fields. The results indicate that the incorporation of Ti 3 C 2 T x MXene as an interface reinforcement phase leads to a tensile strength of the nanocomposites of σ = 93.4 MPa, and an in-plane thermal conductivity of Tc = 5.71 W·m –1 ·K –1 . Detailed studies on the interfacial bonding between nanocomposite components indicate that crack resistance and thermal conductivity positively correlate with interfacial bonding strength. This finding confirms that the rational design of nanocomposite interfaces is a critical factor in enhancing performance. Additionally, finite element simulation results demonstrate that nanocomposites can reduce the maximum electric field intensity at the junction and improve the electric field distribution within the device. This study establishes a feasible nanocomposite model to enhance the performance of multifunctional nanocomposites by developing dual heterointerfaces at the polymer matrix/inorganic filler interface.