journal article·2020-11-25

Hydrogen Bonds Significantly Enhance Out-of-Plane Thermal and Electrical Transport in 2D Graphamid: Implications for Energy Conversion and Storage

Hao Ma, Chen Li, Zhiting Tian

ACS Applied Nano Materials· Volume 3· Issue 11
Publisher page

Abstract

Graphamid is a two-dimensional (2D) polymer. It was predicted to have superior mechanical properties owing to its strong hydrogen bonds. The knowledge of thermal and electrical transport properties in graphamid, which is critical to its future multifunctional applications, remains unknown. Using molecular dynamics simulations and first-principles calculations, we demonstrate that hydrogen bonds drastically enhance out-of-plane thermal and electrical transport in graphamid. The fundamental knowledge from this study can potentially advance the development of 2D hydrogen-bonded polymers for a diverse range of applications, including energy conversion and storage.
Source: openalex_inverted_index · Quality: baseline

Research context

OpenAlex topics: Thermal properties of materials · Graphene research and applications · Advanced Thermoelectric Materials and Devices

SciVX discovery tags are terminology-based. OpenAlex topics are source-provided classifications.

Affiliations

Sibley School of Mechanical and Aerospace Engineering, Cornell University, Ithaca, New York 14853, United States

Funding

Office of Naval Research

References (51)

Show source-provided references
1. 10.1002/anie.20080186310.1002/anie.200801863 ↗
2. 10.1038/nchem.162810.1038/nchem.1628 ↗
3. 10.1021/ja206846p10.1021/ja206846p ↗
4. 10.1002/adma.20170241510.1002/adma.201702415 ↗
5. 10.1038/nmat411310.1038/nmat4113 ↗
6. 10.1002/adma.20150578810.1002/adma.201505788 ↗
7. 10.1038/s41598-018-22011-710.1038/s41598-018-22011-7 ↗
8. 10.1002/adma.20180012910.1002/adma.201800129 ↗
9. 10.1039/C7NR01428G10.1039/C7NR01428G ↗
10. 10.1039/C4NR00547C10.1039/C4NR00547C ↗
11. 10.1038/s41467-019-09697-710.1038/s41467-019-09697-7 ↗
12. 10.1021/acs.macromol.5b0247710.1021/acs.macromol.5b02477 ↗
13. 10.1103/PhysRevMaterials.3.12560410.1103/PhysRevMaterials.3.125604 ↗
14. 10.1038/nmat414110.1038/nmat4141 ↗
15. 10.1039/c4nr01195c10.1039/c4nr01195c ↗
16. 10.1039/C5RA18519J10.1039/C5RA18519J ↗
17. 10.1039/C8NR08760A10.1039/C8NR08760A ↗
18. 10.1002/admi.20160021110.1002/admi.201600211 ↗
19. 10.1021/acsami.6b1207310.1021/acsami.6b12073 ↗
20. 10.1063/1.184068110.1063/1.1840681 ↗
21. 10.1021/ja507132m10.1021/ja507132m ↗
22. 10.1007/s10867-013-9321-010.1007/s10867-013-9321-0 ↗
23. Materials Studio. Accelrys Software Inc., San Diego, 2014. Available from http://accelrys.com/products/materials-studio/.
24. 10.1063/1.492942610.1063/1.4929426 ↗
25. 10.1063/1.497694610.1063/1.4976946 ↗
26. 10.1016/j.applthermaleng.2016.08.15410.1016/j.applthermaleng.2016.08.154 ↗
27. 10.1021/j100023a03610.1021/j100023a036 ↗
28. 10.1039/c0cc02531c10.1039/c0cc02531c ↗
29. 10.1021/acs.nanolett.7b0286710.1021/acs.nanolett.7b02867 ↗
30. Hockney R. W. · 198810.1887/0852743920 ↗
31. 10.1006/jcph.1995.103910.1006/jcph.1995.1039 ↗
32. 10.1063/1.170072210.1063/1.1700722 ↗
33. 10.1063/1.174008210.1063/1.1740082 ↗
34. 10.1063/1.474926510.1063/1.4749265 ↗
35. 10.1002/pen.76006031510.1002/pen.760060315 ↗
36. 10.1088/0953-8984/22/2/02220110.1088/0953-8984/22/2/022201 ↗
37. 10.1016/j.cpc.2006.03.00710.1016/j.cpc.2006.03.007 ↗
38. 10.1016/0263-7855(96)00018-510.1016/0263-7855(96)00018-5 ↗
39. 10.1002/1521-3773(20020104)41:1<48::AID-ANIE48>3.0.CO;2-U10.1002/1521-3773(20020104)41:1<48::AID-ANIE48>3.0.CO;2-U ↗
40. 10.1021/jp903120710.1021/jp9031207 ↗
41. 10.1021/jp053416d10.1021/jp053416d ↗
42. 10.1063/1.356972110.1063/1.3569721 ↗
43. 10.1039/C8NR02994F10.1039/C8NR02994F ↗
44. 10.1557/jmr.2018.36210.1557/jmr.2018.362 ↗
45. 10.1016/j.carbon.2019.03.07610.1016/j.carbon.2019.03.076 ↗
46. 10.1039/C6CP06101J10.1039/C6CP06101J ↗
47. 10.1073/pnas.141944611210.1073/pnas.1419446112 ↗
48. 10.1039/C8RA02436G10.1039/C8RA02436G ↗
49. 10.1021/ja311463b10.1021/ja311463b ↗
50. 10.1039/C6TA03708A10.1039/C6TA03708A ↗
51. 10.1002/chem.20140284410.1002/chem.201402844 ↗