Replication technology for photonic band gap applications

Abstract Replication technology was applied for photonic structure fabrication in silicon substrate. It was revealed, that thin thermoplastic polymer layers on silicon substrates may be patterned by hot embossing technique for dry etching masking. Ni mold used for plain hot embossing into polymer layers was fabricated by Ni electrochemical deposition on the reference silicon surface structure, which was obtained by direct electron beam (EB) writing and SF 6 /N 2 reactive ion etching (RIE) technique. It is shown that the shape of replicated photonic structures is determined by RIE parameters.