Sub-micrometric patterns written using a DIL method coupled to a TiO2 photo-resist

Abstract An all-inorganic TiO2 photo-resist has been formulated through an optimized sol–gel route. This photo-resist has been coupled to an original dynamic interferometric lithography technique to propose a cost effective method compatible with the formation of sub-micrometric diffraction gratings on rather large surfaces using a single-step lithography and a reduced-size set-up. For that purpose, a phase mask has firstly been designed in relation to the specificities of the TiO2 photo-resist. The optical characteristics arising from such a photo-resist have also been assessed. We finally discuss the formation of sub-micrometric gratings in relation to device features (phase mask design, writing light power) and specificities of the all-inorganic photo-resist.