Author Correction: Thermal engineering of interface adhesion for efficient transfer of CVD-grown TMDs

F. E. Perea-Parrales; Ramiro Belmar-Monterrubio; Angel A. Torres-Rosales; Eduardo Martínez-Mercado; Yesenia A. García-Jomaso; Osvaldo del Pozo-Zamudio; Donato Valdez-Pérez; Giuseppe Pirruccio; Edgar A. Cerda-Méndez; Felipe Cervantes-Sodi

doi:10.1038/s41699-025-00633-6

journal article·2025-11-24Open access

Author Correction: Thermal engineering of interface adhesion for efficient transfer of CVD-grown TMDs

F. E. Perea-Parrales, Ramiro Belmar-Monterrubio, Angel A. Torres-Rosales, Eduardo Martínez-Mercado, Yesenia A. García-Jomaso, Osvaldo del Pozo-Zamudio, Donato Valdez-Pérez, Giuseppe Pirruccio, Edgar A. Cerda-Méndez, Felipe Cervantes-Sodi

npj 2D Materials and Applications· Volume 9· Issue 1

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Source abstract

Abstract

Correction to: npj 2D Materials and Applications https://doi.org/10.1038/s41699-025-00594-w , published online 11 August 2025

Only a short abstract or summary was supplied by the source.

Source: openalex_inverted_index · Quality: short

Research context

Nanomaterials

OpenAlex topics: 3D IC and TSV technologies · Electronic Packaging and Soldering Technologies · Copper Interconnects and Reliability

SciVX discovery tags are terminology-based. OpenAlex topics are source-provided classifications.

References

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