On capillary and SLIT die rheometry (Part II)
Bibliographic record
Abstract
No abstract is available for this record. The assistant can identify its topic from the title, but cannot infer the study’s results.
Source: Not provided · Quality: missing
Research context
OpenAlex topics: Copper Interconnects and Reliability · Metal and Thin Film Mechanics · Metal Forming Simulation Techniques
SciVX discovery tags are terminology-based. OpenAlex topics are source-provided classifications.
Affiliations
Laboratory of Paper Technology, Helsinki University of Technology , Helsinki , Finland
References
Reference metadata was not supplied for this record.