The detection and quantification of the defects in adhesive bonded joints of the piezoelectric sensors by infrared thermographic nondestructive testing

In this paper, efficacy of pulsed thermography technique has been explored for the first time for the detection and quantification of the subsurface defects present in the rubber-encapsulated piezoelectric sensors. Initial experiments were performed on adhesively bonded joints of the rubber/Al or rubber/PZT control samples to find out an optimum acquisition time for the 3-mm rubber encapsulants. Thermographic measurements were performed in the reflection mode and acquired thermal images were analysed and processed images were described in terms of the phase images. The defective regions are identified as delamination of the adhesive joints at the interface of rubber and PZT stacks, and presence of porosity in the encapsulation in the inspected hydrophone. The defect depths of the observed anomalies were calculated empirically from the plots of the peak time of thermal contrast (tmax) maximum and thermal contrast maximum (Cmax) for a particular defect. The estimated defect depths of the prominent porosity observed in the PZT hydrophone are found nearly 1 mm from the surface.