STUDY ON THE THERMAL SHOCK RESISTANCE OF GRAPHITE COMPONENTS BONDED WITH HIGH TEMPERATURE ADHESIVES

A high temperature adhesive (HTA) was prepared using Phenol Formaldehyde Resin (PF) as matrix and ceramic powers as additives to modify the performance. The graphite materials were bonded and treated at 800?℃, 1?000?℃, and 1?200?℃ and the thermal shock resistance experiments were carried out. The critical thermal shock temperatures were 800?℃ and 1?000?℃. Results of shear strength test showed that the graphite components bonded with the above HTA had satisfactory thermal shock resistance. The percentage of retained strength was high even after the bonded samples had experienced several thermal shock experiments. In addition, the factors that influenced the thermal shock resistance are also discussed, and some suggestions for enhancing the thermal shock resistance, such as optimizing the composition of HTA, increasing heat treatment temperature and controlling the cement thickness are discussed.