Copper-Coated Reduced Graphene Oxide Fiber Mesh-Polymer Composite Films for Electromagnetic Interference Shielding
Source abstract
Abstract
Expected to become mainstream in the electronics industry, flexible electronics still face major challenging issues. For polymeric-based flexible electronic substrates in particular, these challenges include a lack of electromagnetic shielding capability and poor heat dissipation. Here, we report a highly flexible and thermally conductive macroscopic polydimethylsiloxane (PDMS) polymer film embedded with a copper-coated reduced graphene oxide (rGO) fiber mesh. The rGO fibers are assembled into 3D fiber meshes and electroplated with micrometer-thick copper coatings, displaying excellent electrical and thermal conductivities. Oriented in the horizontal and perpendicular directions within the PDMS polymeric matrix, the fiber mesh serves as a highly electrically and thermally conductive backbone through the in-plane direction. Meanwhile, the fiber mesh also effectively shields electromagnetic interference in the X-band without causing thermal damage. The macroscopic film remains electrically insulated in the through-plane direction. Utilizing both the favorable thermal and electrical properties of the graphene fiber-based mesh and the flexibility of the PDMS matrix, our film may exhibit potential for flexible electronics applications such as wearable electronic thermal management and flexible microwave identification devices.
Source: openalex_inverted_index · Quality: baseline
Research context
OpenAlex topics: Electromagnetic wave absorption materials · Advanced Antenna and Metasurface Technologies · Dielectric materials and actuators
SciVX discovery tags are terminology-based. OpenAlex topics are source-provided classifications.
Affiliations
Department of Mechanical, Aerospace, and Nuclear Engineering, Rensselaer Polytechnic Institute, 110 8th Street, Troy, New York 12180, United States
Department of Material Science and Engineering, Rensselaer Polytechnic Institute, 110 8th Street, Troy, New York 12180, United States
Department of Electrical, Computer, and Systems Engineering, Rensselaer Polytechnic Institute, 110 8th Street, Troy, New York 12180, United States
Funding
National Science Foundation
References (68)
Show source-provided references
1. 10.1109/TCPMT.2015.244875510.1109/TCPMT.2015.2448755 ↗
2. 10.1021/acsnano.8b0629010.1021/acsnano.8b06290 ↗
3. Sorrentino A. · 2011 · 203
4. 10.1002/adom.20180127410.1002/adom.201801274 ↗
5. 10.1109/33.3142210.1109/33.31422 ↗
6. 10.1109/POLYTR.2001.97325110.1109/POLYTR.2001.973251 ↗
7. 10.1109/ICEPT.2014.692264210.1109/ICEPT.2014.6922642 ↗
8. Ardebili H. · 2009
9. 10.1002/admt.20170007810.1002/admt.201700078 ↗
10. 10.1021/acsami.7b0493510.1021/acsami.7b04935 ↗
11. 10.1016/j.carbon.2019.01.03010.1016/j.carbon.2019.01.030 ↗
12. 10.1016/j.carbon.2019.09.04410.1016/j.carbon.2019.09.044 ↗
13. 10.1016/j.carbon.2012.04.03010.1016/j.carbon.2012.04.030 ↗
14. 10.3390/polym909043710.3390/polym9090437 ↗
15. 10.1016/j.compositesb.2018.01.01310.1016/j.compositesb.2018.01.013 ↗
16. 10.1021/acsami.8b0927510.1021/acsami.8b09275 ↗
17. 10.1038/s41565-018-0330-910.1038/s41565-018-0330-9 ↗
18. 10.1002/adma.20150642610.1002/adma.201506426 ↗
19. 10.1002/adma.20160244410.1002/adma.201602444 ↗
20. 10.1126/science.aaa650210.1126/science.aaa6502 ↗
21. 10.1021/acsami.7b1462610.1021/acsami.7b14626 ↗
22. 10.1002/adma.20100051510.1002/adma.201000515 ↗
23. 10.1088/0022-3727/40/23/02110.1088/0022-3727/40/23/021 ↗
24. 10.1007/s10853-018-2813-310.1007/s10853-018-2813-3 ↗
25. 10.1021/cm901247t10.1021/cm901247t ↗
26. 10.1039/C7NR04175F10.1039/C7NR04175F ↗
27. 10.1016/j.electacta.2016.08.14310.1016/j.electacta.2016.08.143 ↗
28. 10.1016/j.apsusc.2011.11.01010.1016/j.apsusc.2011.11.010 ↗
29. 10.1016/j.apsusc.2017.05.25110.1016/j.apsusc.2017.05.251 ↗
30. 10.1021/acs.chemmater.6b0288210.1021/acs.chemmater.6b02882 ↗
31. 10.1002/adma.20140095110.1002/adma.201400951 ↗
32. 10.1038/ncomms1368410.1038/ncomms13684 ↗
33. 10.1016/j.applthermaleng.2019.01.02910.1016/j.applthermaleng.2019.01.029 ↗
34. 10.1016/j.compositesa.2018.06.01010.1016/j.compositesa.2018.06.010 ↗
35. 10.2514/3.269910.2514/3.2699 ↗
36. 10.2514/3.499010.2514/3.4990 ↗
37. 10.1016/j.addma.2018.10.03310.1016/j.addma.2018.10.033 ↗
38. 10.1016/j.compscitech.2019.10784710.1016/j.compscitech.2019.107847 ↗
39. 10.1038/s41528-019-0050-810.1038/s41528-019-0050-8 ↗
40. 10.1002/adfm.20190519710.1002/adfm.201905197 ↗
41. 10.1016/j.compositesb.2019.01.06610.1016/j.compositesb.2019.01.066 ↗
42. 10.1016/j.matlet.2018.10.07410.1016/j.matlet.2018.10.074 ↗
43. 10.1109/TEMC.2019.294354910.1109/TEMC.2019.2943549 ↗
44. 10.1007/s13233-020-8024-110.1007/s13233-020-8024-1 ↗
45. 10.1016/j.carbon.2018.09.08110.1016/j.carbon.2018.09.081 ↗
46. 10.1016/j.compositesb.2018.06.02610.1016/j.compositesb.2018.06.026 ↗
47. 10.1016/j.compositesb.2019.02.04410.1016/j.compositesb.2019.02.044 ↗
48. 10.1021/am500445g10.1021/am500445g ↗
49. 10.1002/admt.20190076110.1002/admt.201900761 ↗
50. 10.1039/C8NR07351A10.1039/C8NR07351A ↗
51. 10.1016/j.carbon.2018.03.06110.1016/j.carbon.2018.03.061 ↗
52. 10.1002/adfm.20150378210.1002/adfm.201503782 ↗
53. 10.1021/acsami.7b0101710.1021/acsami.7b01017 ↗
54. 10.1016/j.compositesa.2020.10588710.1016/j.compositesa.2020.105887 ↗
55. 10.1021/acsami.9b2305210.1021/acsami.9b23052 ↗
56. 10.1021/acsami.9b0650910.1021/acsami.9b06509 ↗
57. 10.1016/j.matpr.2017.10.19710.1016/j.matpr.2017.10.197 ↗
58. 10.1039/C9RA04244J10.1039/C9RA04244J ↗
59. 10.1002/adma.20120419610.1002/adma.201204196 ↗
60. 10.1021/acsami.6b0041810.1021/acsami.6b00418 ↗
61. 10.1016/j.rinp.2019.10236510.1016/j.rinp.2019.102365 ↗
62. 10.1016/j.compscitech.2020.10799410.1016/j.compscitech.2020.107994 ↗
63. 10.1002/adma.20120344810.1002/adma.201203448 ↗
64. 10.1007/s12034-011-0083-710.1007/s12034-011-0083-7 ↗
65. Parveen S. · 2012 · 73
66. 10.1016/j.compscitech.2016.10.00810.1016/j.compscitech.2016.10.008 ↗
67. 10.1016/j.carbon.2013.08.04310.1016/j.carbon.2013.08.043 ↗
68. 10.1016/j.synthmet.2011.04.03310.1016/j.synthmet.2011.04.033 ↗