journal article·2025

Nanoscale electron transfer mechanism in metallized polypropylene films

Zhi-Yuan Wu, Lei Huang, Shao-Long Zhong, Zhi-Yuan Wang, Jian-Tao Wang, Zhi-Min Dang, Wei Wang

Nanoscale· Volume 17· Issue 16
Publisher page

Abstract

Metallized biaxially oriented polypropylene (BOPP) films are widely used in electronics and electrical power systems. However, as the demand for metallized films (MFs) with enhanced properties increases across various applications, studying the micro-level electron transfer mechanisms has become a promising approach to regulate the electrical characteristics of the metallized films. In this work, we systematically investigated the surface electron transfer mechanism, space charge distribution injected from external electrodes at the nanoscale, and macro-level electrical characteristics in different MFs. Results revealed that the MFs with thinner metallized layers exhibited greater surface charge accumulation, slower dissipation and reduced charge injection into the dielectric layer, thereby affecting the dielectric constant, leakage current, breakdown property and self-healing characteristics of the samples. We employed tunnelling current measurements using atomic force microscopy (AFM) to calculate the energy barrier height in different metallized films for studying the influence mechanism of the metallized layer thickness and the introduction of BaTiO3. These results established a relationship between electron transfer at the nanoscale and macro-level material electrical properties of different BOPP metallized films. Additionally, the results of space charge testing indicated that the accumulation amount of space charge determined the energy storage capacity of the MFs, and at the same time, a bipolar carrier simulation model was developed to validate the electron transfer mechanism. The simulation results aligned well with the experimental findings, further confirming the influence of the BaTiO3 composite layer on nanoscale charge transfer dynamics.
Source: europepmc · Quality: candidate unverified · Source record ↗

Research context

OpenAlex topics: High voltage insulation and dielectric phenomena

SciVX discovery tags are terminology-based. OpenAlex topics are source-provided classifications.

Affiliations

Beijing Key Laboratory of High Voltage and Electromagnetic Compatibility, North China Electric Power, University, Beijing, China

State Key Laboratory of Power System Operation and Control, Department of Electrical Engineering, Tsinghua University, Beijing 10084, China

Funding

National Basic Research Program of China · Tongji University · National Natural Science Foundation of China

References (29)

Show source-provided references
1. Brown · IEEE Trans. Device Mater. Reliab. · 2006 · 6 · 32610.1109/TDMR.2006.876612 ↗
2. Ma · Electronics · 2020 · 9 · 189310.3390/electronics9111893 ↗
3. Charlton · Proc. Inst. Electr. Eng., Part B · 1962 · 109 · 476
4. Yang · Surf. Eng. · 2021 · 37 · 105110.1080/02670844.2021.1918933 ↗
5. Valentine · Microelectron. Reliab. · 2019 · 92 · 12310.1016/j.microrel.2018.11.003 ↗
6. Jamieson · J. Mater. Sci. · 1983 · 18 · 6410.1007/BF00543811 ↗
7. Wu · High Voltage · 2024 · 9 · 134710.1049/hve2.12459 ↗
8. Gong · ACS Appl. Electron. Mater. · 2023 · 5 · 555510.1021/acsaelm.3c00848 ↗
9. Zhang · Chem. Mater. · 2016 · 28 · 464610.1021/acs.chemmater.6b01383 ↗
10. Zheng · Nano Energy · 2018 · 48 · 14410.1016/j.nanoen.2018.03.049 ↗
11. Tortai · J. Electrost. · 2001 · 53 · 15910.1016/S0304-3886(01)00138-3 ↗
12. Pan · IEEE Trans. Dielectr. Electr. Insul. · 2024 · 31 · 166610.1109/TDEI.2024.3357441 ↗
13. B.Walgenwitz , J. H.Tortai , N.Bonifaci
14. Belko · IEEE Trans. Plasma Sci. · 2021 · 49 · 158010.1109/TPS.2021.3071187 ↗
15. Li · Microelectron. Reliab. · 2015 · 55 · 272110.1016/j.microrel.2015.09.007 ↗
16. Peng · IEEE Trans. Dielectr. Electr. Insul. · 2010 · 17 · 161210.1109/TDEI.2010.5595565 ↗
17. Y.Chen , F.Lin , H.Li
18. Zhu · Microelectron. Reliab. · 2023 · 144 · 11497210.1016/j.microrel.2023.114972 ↗
19. Belko · IEEE Trans. Plasma Sci. · 2021 · 49 · 189810.1109/TPS.2021.3076007 ↗
20. Liu · IEEE Trans. Dielectr. Electr. Insul. · 2021 · 28 · 126410.1109/TDEI.2021.009585 ↗
21. Zhang · J. Appl. Polym. Sci. · 2024 · 141 · 5613710.1002/app.56137 ↗
22. Lin · Adv. Mater. · 2019 · 31 · 190141810.1002/adma.201901418 ↗
23. Shen · Appl. Phys. Lett. · 2017 · 111 · 106310.1063/1.4991079 ↗
24. Yewen · High Voltage Engineering · 2014 · 40 · 2613
25. Frammelsberger · Mater. Sci. Eng., B · 2005 · 116 · 16810.1016/j.mseb.2004.09.027 ↗
26. Li · Micron · 2010 · 41(5) · 41610.1016/j.micron.2010.02.010 ↗
27. Frammelsberger · Mater. Sci. Eng., B · 2005 · 116 · 16810.1016/j.mseb.2004.09.027 ↗
28. Heinisch · Phys. Rev. B:Condens. Matter Mater. Phys. · 2012 · 85 · 07532310.1103/PhysRevB.85.075323 ↗
29. Yang · J. Phys. D: Appl. Phys. · 2017 · 50 · 50530510.1088/1361-6463/aa98ad ↗