Reversible switching in bicontinuous structure for phase change random access memory application
Source abstract
Abstract
SiSbTe phase change materials (PCMs) have excellent thermal stabilities. Their properties and microstructures are strongly affected by their Si content. Si3.3Sb2Te3 (SST) gives the best electrical performance, at Si contents of around 40%. Here, use of a combination of an advanced three-dimensional (3D) tomography technique and transmission electron microscopy clearly showed that a crystallized SST film has a uniform equiaxed-structure in 3D space, and consists of a reversible Sb2Te3 (ST) phase and an amorphous (a-) Si phase, which are well nested with each other. The a-Si nest localizes structure switching and diffusion of the host element in the nano-area. The most innovative aspect is significant retention of the metastable face-centered cubic (f-) ST phase, even above 370 °C, in this bicontinuous system. Specifically, the a-Si frame is stable and the ST phase switches between a- and f-structures under external stimulation. This promotes faster SET speed and low-power RESET consumption. Our results give new insights into PCM systems. They suggest that bicontinuous structures are potential candidates for use in phase-change random access memory devices, especially in automotive electronics applications that require a high data retention ability.
Source: openalex_inverted_index · Quality: candidate unverified · Source record ↗
Research context
OpenAlex topics: Phase-change materials and chalcogenides · Liquid Crystal Research Advancements · Transition Metal Oxide Nanomaterials
SciVX discovery tags are terminology-based. OpenAlex topics are source-provided classifications.
Affiliations
Key Laboratory of Polar Materials and Devices (MOE)
Department of Electronics
East China Normal University
Shanghai 200241
China
State Key Laboratory of Functional Materials for Informatics
Shanghai Institute of Microsystem and Information Technology
Chinese Academy of Sciences
Shanghai 200050
Funding
National Natural Science Foundation of China · National Key Research and Development Program of China · Thermo Fisher Scientific
References (42)
Show source-provided references
1. Ovshinsky · Phys. Rev. Lett. · 1968 · 21 · 145010.1103/PhysRevLett.21.1450 ↗
2. I. S. Kim , S. L.Cho , D. H.Im , E. H.Cho , D. H.Kim , G. H.Oh , D. H.Ahn , S. O.Park , S. W.Nam , J. T.Moon and C. H.Chung , in 2010 Symposium on VLSI Technology , Honolulu, Hawaii , 2010 , pp. 203–204
3. Wang · Appl. Phys. Lett. · 2018 · 112 · 13310410.1063/1.5012872 ↗
4. W. Kim , M.BrightSky , T.Masuda , N.Sosa , S.Kim , R.Bruce , F.Carta , G.Fraczak , H. Y.Cheng , A.Ray , Y.Zhu , H. L.Lung , K.Suu and C.Lam , in 2016 IEEE IEDM , San Francisco, USA , 2016 , pp. 4.2.1–4.2.4
5. Zheng · Sci. Rep. · 2017 · 7 · 591510.1038/s41598-017-06426-2 ↗
6. Cheng · ACS Appl. Mater. Interfaces · 2020 · 12 · 2305110.1021/acsami.0c02507 ↗
7. Wang · IEEE Electron Device Lett. · 2014 · 35 · 53610.1109/LED.2014.2308909 ↗
8. H. Y. Cheng , T. H.Hsu , S.Raoux , J. Y.Wu , P. Y.Du , M.Breitwisch , Y.Zhu , E. K.Lai , E.Joseph , S.Mittal , R.Cheek , A.Schrott , S. C.Lai , H. L.Lung and C.Lam , in 2011 IEEE IEDM , Washington, DC, USA , 2011 , pp. 3.4.1–3.4.4
9. Do · Electrochem. Solid-State Lett. · 2010 · 13 · H28410.1149/1.3439647 ↗
10. Kolobov · Nat. Mater. · 2004 · 3 · 70310.1038/nmat1215 ↗
11. Kohara · Appl. Phys. Lett. · 2006 · 89 · 20191010.1063/1.2387870 ↗
12. Shportko · Nat. Mater. · 2008 · 7 · 65310.1038/nmat2226 ↗
13. Morales-Sánchez · Thin Solid Films · 2005 · 471 · 24310.1016/j.tsf.2004.06.141 ↗
14. Zhang · Solid-State Electron. · 2007 · 51 · 95010.1016/j.sse.2007.03.016 ↗
15. Zhang · Jpn. J. Appl. Phys. · 2007 · 46 · L24710.1143/JJAP.46.L247 ↗
16. Zhang · Appl. Phys. A · 2008 · 90 · 45110.1007/s00339-007-4302-4 ↗
17. Cheng · J. Non-Cryst. Solids · 2010 · 356 · 88410.1016/j.jnoncrysol.2010.01.002 ↗
18. Cheng · Appl. Phys. Lett. · 2008 · 93 · 18311310.1063/1.3013513 ↗
19. Cheng · Mater. Sci. Forum · 2015 · 815 · 4410.4028/www.scientific.net/MSF.815.44 ↗
20. Qiao · Semicond. Sci. Technol. · 2006 · 21 · 107310.1088/0268-1242/21/8/016 ↗
21. Feng · J. Appl. Phys. · 2007 · 101 · 07450210.1063/1.2717562 ↗
22. Zhang · Jpn. J. Appl. Phys. · 2007 · 46 · L7010.1143/JJAP.46.L70 ↗
23. Zhang · Appl. Surf. Sci. · 2008 · 254 · 560210.1016/j.apsusc.2008.03.006 ↗
24. Ren · Jpn. J. Appl. Phys. · 2010 · 49 · 08021210.1143/JJAP.49.080212 ↗
25. Rao · Nanotechnology · 2011 · 22 · 14570210.1088/0957-4484/22/14/145702 ↗
26. Rao · Acta Mater. · 2012 · 60 · 32310.1016/j.actamat.2011.09.015 ↗
27. Zheng · Nano Res. · 2016 · 9 · 345310.1007/s12274-016-1221-8 ↗
28. Rao · Science · 2017 · 358 · 142310.1126/science.aao3212 ↗
29. D. B. Williams and C. B.Carter , Transmission electron microscopy A textbook for materials science , Springer , Berlin , 2nd edn, 200910.1007/978-0-387-76501-3 ↗
30. Zheng · Commun. Chem. · 2019 · 2 · 1310.1038/s42004-019-0114-7 ↗
31. J. Frank , Electron Tomography: Three-dimensional Imaging with the Transmission Electron Microscope , Springer , New York , 2013
32. Midgley · J. Phys. Chem. B · 2004 · 108 · 459010.1021/jp049750b ↗
33. Loke · Proc. Natl. Acad. Sci. U. S. A. · 2014 · 111 · 1327210.1073/pnas.1407633111 ↗
34. McLachlan · J. Am. Ceram. Soc. · 1990 · 73 · 218710.1111/j.1151-2916.1990.tb07576.x ↗
35. Yi · Phys. Rev. E: Stat., Nonlinear, Soft Matter Phys. · 2009 · 79 · 04113410.1103/PhysRevE.79.041134 ↗
36. Priour Jr. · Phys. Rev. Lett. · 2018 · 121 · 22570110.1103/PhysRevLett.121.225701 ↗
37. Lin · Int. J. Heat Mass Transfer · 2019 · 138 · 133310.1016/j.ijheatmasstransfer.2019.04.110 ↗
38. Xu · Soft Matter · 2018 · 14 · 868410.1039/C8SM01488D ↗
39. Lin · Powder Technol. · 2020 · 360 · 94410.1016/j.powtec.2019.10.054 ↗
40. Wang · Phys. Chem. Chem. Phys. · 2014 · 16 · 1081010.1039/c3cp55476g ↗
41. G. Novielli , A.Ghetti , E.Varesi , A.Mauri and R.Sacco , in 2013 IEEE IEDM , Washington, DC, USA , 2013 , pp. 22.3.1–22.3.4
42. Chong · Appl. Phys. Lett. · 2006 · 88 · 12211410.1063/1.2181191 ↗