Applying SEM, EPMA and EBSD Analytic Techniques on Solder Joint for Microelectronic Package Development
Source abstract
Abstract
Tzu-Ting Chou, Rui-Wen Song, Jenq-Gong Duh; Applying SEM, EPMA and EBSD Analytic Techniques on Solder Joint for Microelectronic Package Development, Micros
Only a short abstract or summary was supplied by the source.
Source: openalex_inverted_index · Quality: short
Research context
OpenAlex topics: Electron and X-Ray Spectroscopy Techniques · Integrated Circuits and Semiconductor Failure Analysis · Electronic Packaging and Soldering Technologies
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References
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