Micro-Mechanical In Situ Measurements in Thin Film Systems Regarding the Determination of Residual Stress, Fracture Properties and Interface Toughness
Source abstract
Abstract
R Konetschnik, D Kiener, D Kozic, H-P Ganser, R Brunner; Micro-Mechanical In Situ Measurements in Thin Film Systems Regarding the Determination of Residual
Only a short abstract or summary was supplied by the source.
Source: openalex_inverted_index · Quality: short
Research context
OpenAlex topics: Metal and Thin Film Mechanics · Advanced materials and composites · Electronic and Structural Properties of Oxides
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References (4)
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1. 10.1016/j.actamat.2015.10.04410.1016/j.actamat.2015.10.044 ↗
2. Arden W. , et al‘More-than-Moore' White Paper, “International Technical Roadmap for Semiconductors, 2010.
3. 10.1016/j.eml.2016.01.00410.1016/j.eml.2016.01.004 ↗
4. Financial support from the Austrian Federal Government (in particular from Bundesministerium für Verkehr, Innovation und Technologie and Bundesministerium für Wissenschaft, Forschung und Wirtschaft) represented by Österreichische Forschungsförderungsgesellschaft mbH and the Styrian and the Tyrolean Provincial Government, represented by Steirische Wirtschaftsförderungsgesellschaft mbH and Standortagentur Tirol, within the framework of the COMET Funding Programme (No. 837900) is also gratefully acknowledged.