journal article·2004-08

Effect of Microstructure on Die Punch Failures

James F. Lane, Thomas N. Ackerson

Microscopy and Microanalysis· Volume 10· Issue S02
Publisher page

Abstract

Extended abstract of a paper presented at Microscopy and Microanalysis 2004 in Savannah, Georgia, USA, August 1–5, 2004.
Only a short abstract or summary was supplied by the source.
Source: crossref · Quality: short

Research context

OpenAlex topics: Integrated Circuits and Semiconductor Failure Analysis · Microstructure and Mechanical Properties of Steels · Metallurgy and Material Forming

SciVX discovery tags are terminology-based. OpenAlex topics are source-provided classifications.

References

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