Utilizing Focused Ion Beam (FIB) and Transmission Electron Microscopy (TEM) for Failure Analysis of Char Deposits Obtained From Space Shuttle Columbia Window Debris
Source abstract
Abstract
Extended abstract of a paper presented at Microscopy and Microanalysis 2011 in Nashville, Tennessee, USA, August 7–August 11, 2011.
Only a short abstract or summary was supplied by the source.
Source: crossref · Quality: short
Research context
OpenAlex topics: Integrated Circuits and Semiconductor Failure Analysis · Ion-surface interactions and analysis · Radiation Effects in Electronics
SciVX discovery tags are terminology-based. OpenAlex topics are source-provided classifications.
References
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