Shock Induced Fracture of SAC Solder Balls Under Tensile Load
Source abstract
Abstract
Extended abstract of a paper presented at Microscopy and Microanalysis 2007 in Ft. Lauderdale, Florida, USA, August 5 – August 9, 2007
Only a short abstract or summary was supplied by the source.
Source: openalex_inverted_index · Quality: short
Research context
OpenAlex topics: Electronic Packaging and Soldering Technologies · Integrated Circuits and Semiconductor Failure Analysis · 3D IC and TSV technologies
SciVX discovery tags are terminology-based. OpenAlex topics are source-provided classifications.
References
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