journal article·2005-08Open access

Evaluation of Grain Growth and Bonding in Roll Bonded Aluminum Alloy Plates

E A Kenik, T J Huxford, J R Mayotte, T S Nedkova, J D Sease

Microscopy and Microanalysis· Volume 11· Issue S02

Abstract

Extended abstract of a paper presented at Microscopy and Microanalysis 2005 in Honolulu, Hawaii, USA, July 31--August 4, 2005
Only a short abstract or summary was supplied by the source.
Source: openalex_inverted_index · Quality: short

Research context

OpenAlex topics: Metal Forming Simulation Techniques · Advanced Welding Techniques Analysis · Aluminum Alloys Composites Properties

SciVX discovery tags are terminology-based. OpenAlex topics are source-provided classifications.

References

Reference metadata was not supplied for this record.