Curtaining-Free Top-Down TEM Lamella Preparation from a Cutting Edge Integrated Circuit
Source abstract
Abstract
Andrey Denisyuk, Tomáš Hrnčíř, Jozef Vincenc Oboňa, Martin Petrenec, Jan Michalička; Curtaining-Free Top-Down TEM Lamella Preparation from a Cutting Edge I
Only a short abstract or summary was supplied by the source.
Source: openalex_inverted_index · Quality: short
Research context
OpenAlex topics: Semiconductor materials and devices · Advanced Machining and Optimization Techniques · Advanced Surface Polishing Techniques
SciVX discovery tags are terminology-based. OpenAlex topics are source-provided classifications.
References (2)
Show source-provided references
1. 40th ISTFA Conf. Proc · 2014 · 136
2. 10.1117/12.201159410.1117/12.2011594 ↗