Mechanical Size-Effects and Dislocation Dynamics in Cu Thin Films
Source abstract
Abstract
Gerhard Dehm, Hervais Edongue, T John Balk, Eduard Arzt; Mechanical Size-Effects and Dislocation Dynamics in Cu Thin Films, Microscopy and Microanalysis, V
Only a short abstract or summary was supplied by the source.
Source: openalex_inverted_index · Quality: short
Research context
OpenAlex topics: Copper Interconnects and Reliability · Surface and Thin Film Phenomena · Metal and Thin Film Mechanics
SciVX discovery tags are terminology-based. OpenAlex topics are source-provided classifications.
References
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