Microscopy of Solder Joint Failures Due to Gold Intermetallic Embrittlement
Source abstract
Abstract
Extended abstract of a paper presented at Microscopy and Microanalysis 2005 in Honolulu, Hawaii, USA, July 31--August 4, 2005
Only a short abstract or summary was supplied by the source.
Source: openalex_inverted_index · Quality: short
Research context
OpenAlex topics: Electronic Packaging and Soldering Technologies · Aluminum Alloys Composites Properties · Aluminum Alloy Microstructure Properties
SciVX discovery tags are terminology-based. OpenAlex topics are source-provided classifications.
References
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