Identification of Tin Whisker Growth on Tin Plated Copper Substrate
Source abstract
Abstract
A Knight, H Aglan, D Burdick; Identification of Tin Whisker Growth on Tin Plated Copper Substrate, Microscopy and Microanalysis, Volume 23, Issue S1, 1 Jul
Only a short abstract or summary was supplied by the source.
Source: openalex_inverted_index · Quality: short
Research context
OpenAlex topics: Mechanical stress and fatigue analysis · Electronic Packaging and Soldering Technologies · Vibration and Dynamic Analysis
SciVX discovery tags are terminology-based. OpenAlex topics are source-provided classifications.
References (3)
Show source-provided references
1. Spontaneous Growth Mechanism of Tin Whiskers
2. Sampson Michael & Leidecker Henning N.p., n.d. Web. 1 Nov. 2016. .
3. 10.1016/j.microrel.2006.04.01110.1016/j.microrel.2006.04.011 ↗