Accelerated Electromigration Study of Cobalt Thin Films by In-Situ TEM
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OpenAlex topics: Copper Interconnects and Reliability · Semiconductor materials and interfaces · Metallurgical and Alloy Processes
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References (6)
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1. 10.1016/0040-6090(76)90008-010.1016/0040-6090(76)90008-0 ↗
2. 10.1109/IITC.2018.843040710.1109/IITC.2018.8430407 ↗
3. 10.1063/1.494221610.1063/1.4942216 ↗
4. This work was supported by the NYSTAR Focus Center at RPI, C150117, and made extensive use of cleanroom and characterization facilities in the Center for Materials, Devices and integrated Systems (cMDIS) at RPI.
5. Hu · IEEE International Reliability Physics Symposium Proceedings · 2018 · 4F.11
6. 10.1016/0022-3697(77)90230-X10.1016/0022-3697(77)90230-X ↗