Tin Whiskers: Electron Microscopy and EBSD Characterization
Source abstract
Abstract
Extended abstract of a paper presented at Microscopy and Microanalysis 2010 in Portland, Oregon, USA, August 1 – August 5, 2010.
Only a short abstract or summary was supplied by the source.
Source: crossref · Quality: short
Research context
OpenAlex topics: Electronic Packaging and Soldering Technologies
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References
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