journal article·2009-07

CVD diamond/substrate interface FIB preparation of cutting tools

S. B. Peripolli, F. A. Almeida, L. S. Gomes, F. J. Oliveira, R. F. Silva, C. A. Achete

Microscopy and Microanalysis· Volume 15· Issue S3
Publisher page

Abstract

Abstract CVD diamond coated cutting tools are used for machining of abrasive and hard materials such as Al-Si alloys and tungsten carbide. The knowledge of the mechanisms governing the diamond/substrate interfacial strength is crucial in cutting tools design. The most adequate substrate material for maximizing the adhesion of diamond films is the silicon nitride (Si3N4) ceramic that possesses a thermal expansion coefficient similar to that of diamond. Buchkremer-Hermanns and co-workers consider the formation of a SiC interlayer between diamond and Si3N4, which may favour chemical bonding to diamond, although they could not detect it by glazing incidence X-Ray diffraction. They believed that insufficient detection sensitivity for very thin films, texture effects or presence of amorphous layers are possible reasons. In the case of TiN substrates, a graded interlayer of amorphous TiCN of only 8 Å was suggested by Contreras, as observed by HRTEM images and EDS measurements. Due to the difficulty in the detection of such layers, which can be in the order of a few angstrons, a definite evidence of their nature is yet to be demonstrated.
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Research context

OpenAlex topics: Diamond and Carbon-based Materials Research · Metal and Thin Film Mechanics · Advanced Surface Polishing Techniques

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