journal article·2019-08Open access

Ar+ FIB Milling and Measurement of FIB Damage in Silicon

Brandon Van Leer, Huikai Cheng, Mikhail Dutka

Microscopy and Microanalysis· Volume 25· Issue S2

Abstract

Brandon Van Leer, Huikai Cheng, Mikhail Dutka; Ar+ FIB Milling and Measurement of FIB Damage in Silicon, Microscopy and Microanalysis, Volume 25, Issue S2,
Only a short abstract or summary was supplied by the source.
Source: openalex_inverted_index · Quality: short

Research context

OpenAlex topics: Integrated Circuits and Semiconductor Failure Analysis · Advanced Surface Polishing Techniques · Metal and Thin Film Mechanics

SciVX discovery tags are terminology-based. OpenAlex topics are source-provided classifications.

References (3)

Show source-provided references
1. JF Ziegler and JP Biersack , SRIM 2003, www.SRIM.com.
2. Giannuzzi · Microscopy and Microanalysis · 2005 · 11
3. Van Leer · Microscopy and Microanalysis · 2013