PEC Reliability in 3D E-beam DOE Nanopatterning.
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Abstract
Stanislav Krátký, Michal Urbánek, Vladimir Kolařík; PEC Reliability in 3D E-beam DOE Nanopatterning., Microscopy and Microanalysis, Volume 21, Issue S4, 1
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Source: openalex_inverted_index · Quality: short
Research context
OpenAlex topics: Advancements in Photolithography Techniques · Nanofabrication and Lithography Techniques · Integrated Circuits and Semiconductor Failure Analysis
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References (10)
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1. The authors acknowledge funding from MEYS CR (project No. LO1212), the TACR project No. TE 01020233 and by the institutional support RVO: 68081731.
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