journal article·2010-07

Ultra-thin TEM Sample Preparation with Advanced Backside FIB Milling Method

H-J Kang, JH Kim, JW Oh, TS Back, HJ Kim

Microscopy and Microanalysis· Volume 16· Issue S2
Publisher page

Abstract

Extended abstract of a paper presented at Microscopy and Microanalysis 2010 in Portland, Oregon, USA, August 1 – August 5, 2010.
Only a short abstract or summary was supplied by the source.
Source: crossref · Quality: short

Research context

OpenAlex topics: Advanced Materials Characterization Techniques · Advanced Electron Microscopy Techniques and Applications · Integrated Circuits and Semiconductor Failure Analysis

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References

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